What’s New in Simcenter FloTherm Releases
Highlights include material map capabilities for a PCB thermal analysis workflow, PCB thermal via modeling capabilities and more.
Release offers faster modeling incorporating the Material Map SmartPart modeling approach. Image courtesy of Siemens.
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April 12, 2024
The Simcenter Flotherm 2404 and Simcenter Flotherm XT 2404 electronics cooling simulation software releases are now available from Siemens Digital Industries Software.
Simcenter Flotherm 2404
Material Map SmartPart
The Material Map SmartPart in Simcenter Flotherm 2404 electronics cooling software leverages imported Material Map files to enable faster, accurate modeling of modern integrated circuit packages and printed circuit boards compared to typical modeling approaches that consist of thousands of geometric objects.
Simcenter Flotherm XT 2404
Model PCB Thermal Vias
New PCB thermal via modeling capabilities have been added to the Simcenter Flotherm XT EDA Bridge so you can more easily explore thermal management options:
- Quickly add thermal vias under a component
- Thermal vias are created as a cuboid representation of an array with orthotropic material properties when transferred to Simcenter Flotherm XT
For greater product detail, click here.
Download Software Releases Now
For existing users, visit these support center links:
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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