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Siemens Streamlines ECAD-MCAD Collaboration

At Siemens Realize LIVE in Detroit this week, Siemens unveiled new 3D electrical design capabilities within its Capital software to unify wiring design and physical harness routing in a single, model-based workflow across its Siemens Xcelerator software portfolio. According to the company, the new capabilities enable electrical and mechanical engineers to work…
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May 2026 Special Focus: Artificial Intelligence in Design and Simulation

In this Special Focus Issue, learn about the latest developments in the integration of artificial intelligence into engineering workflows.

Siemens Streamlines ECAD-MCAD Collaboration

June 4, 2026 · Capital electrical design software is now integrated into Designcenter and Teamcenter.

May 2026 Special Focus: Artificial Intelligence in Design and Simulation

May 27, 2026 · In this Special Focus Issue, learn about the latest developments in the integration of artificial intelligence into engineering workflows.

Tim Costa, NVIDIA, Discusses Enthusiasm for AI Integration Among CAE Vendors

May 15, 2026 · Tim Costa, NVIDIA, Discusses Enthusiasm for AI Integration Among CAE Vendors

PTC and Altium Streamline Electrical, Mechanical CAD Integration

May 13, 2026 · PTC's Onshape CAD and PDM platform integrated with Altium electronics design platform.

MathWorks Adds AI Copilots to MATLAB and Simulink 

April 28, 2026 · The new MathWorks Release 2026a includes Simulink Copilot and Polyspace Copilot to accelerate development.

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Easing the Transition from ETO to CTO with Configuration Lifecycle Management

April 23, 2026 · Manufacturers are discovering that the Configure-to-Order (CTO) model provides significant benefits when it comes to customization.

Cadence, Google Partner for AI-Driven Chip Design

April 20, 2026 · Integration of Google’s Gemini models with Cadence ChipStack AI Super Agent accelerates agent-driven design automation.

NVIDIA Brings Agentic AI to Engineering Software

March 18, 2026 · Dassault, Siemens, Cadence, PTC and Synopsys team with NVIDA on GPU-accelerated AI for engineering.

Cadence, NVIDIA Collaborate on Agentic AI Chip and System Design

March 17, 2026 · New agentic integrated circuit (IC) and physical AI accelerated solutions enable engineers to solve previously impossible chip, system and AI factory challenges.

Siemens Fuse EDA AI Agent System Automates Semiconductor Design Workflows

March 17, 2026 · Fuse EDA AI Agent autonomously orchestrates multi-agent workflows across Siemens' complete electronic design automation (EDA) portfolio, from design conception through manufacturing sign-off.

Synopsys Converge: ECAD in the Age of Physical AI

March 13, 2026 · Conference consolidates SNUG Silicon Valley, Ansys Simulation World, and a by-invitation-only Executive Forum.

ByteSnap Design Releases Interactive BOM Health Assessment Tool

March 9, 2026 · Tool intended to help engineering managers and technical directors understand their organization’s exposure to component obsolescence risk.

Future Electronics, SnapMagic Kick off CAD Model Integration

March 6, 2026 · The new integration brings over 10 million CAD assets into the Future Electronics digital experience.

Keysight Debuts 3D Interconnect Designer

February 17, 2026 · Solution addresses design bottleneck by automating complex workflows, Keysight reports.

Siemens Buys Canopus AI

February 5, 2026 · Acquisition extends Siemens’ EDA software portfolio with computational metrology and inspection to help chipmakers solve technical challenges in semiconductor manufacturing.

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The Best Repairs Make Your Safety Equipment More Reliable Than New

January 21, 2026 · By targeting original design flaws and using superior components, specialized repair services can create a stronger, more dependable piece of equipment. In this article, Global Electronic Services explains how their expert repair services can address a range of equipment failures and reduce costly downtime.

Zuken and LogicSwap Launch Free Data Migration Software

January 20, 2026 · The software provides a direct, automated path for converting legacy OrCAD data into eCADSTAR-compatible formats.

Certus Semiconductor Deploys Custom IC Verification

December 8, 2025 · Company will use Siemens AI-based Solido software for custom IC design.

SOLIDWORKS 2026: Generative AI for Design

November 19, 2025 · The new version of SOLIDWORKS from Dassault Systèmes leverages artificial intelligence to increase productivity, improves large assembly workflows, file management, and more.

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Time Is Money: Save Both This Cyber Monday with Capital X Panel Designer

November 6, 2025 · This Cyber Monday, engineers can save both time and money by upgrading their workflows with Siemens' cloud-native Capital X Panel Designer.


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