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3DEXPERIENCE World 2024: AI-Integrated Design and Simulation Set to Become Backbone
SolidWorks CEO Manish Kumar Outlines Strategies for User Community at 3DEXPERIENCE World
Semiconductor design technology will be integrated with Ansys physics and AI capabilities.
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Special Industry Focus: Electronics Design
In this Special Focus Issue of Digital Engineering, learn about new innovations in electronics design, including printed electronics, 5G design, and eCAD.
Keysight Unveils QuantumPro Workflow
February 28, 2024
Lowers hardware engineer knowledge barrier for simulating superconducting qubits with automated quantum parameter extraction.
Hawk Ridge Partners With EMA Design
February 9, 2024
Hawk Ridge Systems will now sell and distribute Cadence and EMA ECAD design solutions to their customers.
3D Printed E-Skin May Open Gate to Human-Machine Interaction
January 31, 2024
Student researchers have developed a 3D-printed electronic skin that can flex, stretch and sense like human skin, opening the door for new advances in human-machine interaction.
Siemens Delivers Thermal Digital Twin Technology
January 26, 2024
High-fidelity thermal simulation data can be shared in the electronic supply chain while protecting semiconductor OEM’s intellectual property, according to Siemens.
Keysight Launches Chiplet PHY Designer
January 26, 2024
New product leverages Keysight EDA’s technology and history of success simulating complex physical layer standards such as SerDes and memory.
EMA to Create Accelerated Designs IP Company
December 5, 2023
New spinoff business unit will provide multi-CAD support & expertise worldwide, EMA reports.
Keysight Highlights EDA 2024 Integrated Software Tools
September 29, 2023
This integrated EDA software is designed to increase productivity for engineers developing high-speed products in multiple applications, the company reports.
Zuken Introduces AIPR for CR-8000
September 20, 2023
Company offers a three-stage approach to artificial intelligence-powered printed circuit board design within its flagship CR-8000 platform.
Altair and EMA Design Automation Integrate Solutions
September 20, 2023
Ultra Librarian gives Altair users access to more than 16 million symbols, footprints and 3D models.
Zuken Unveils CR-8000 2023 for PCB Designs
September 1, 2023
The 2023 release is packed with enhancements covering the design process.
SaaS Gains Ground in ECAD
August 23, 2023
Simulation drives ECAD to subscription.
Playful Magic and Functional Esthetics
August 17, 2023
Incorporating electronics to raise the bar for toys and accessories.
Boston Micro Fabrication Secures $24M Series D Funding
August 15, 2023
The new capital infusion will support development of end-use products across life sciences, dental and electronics industries.
Nano Dimension Acquires Additive Flow Technology
August 15, 2023
This technology is said to be an enabler for leveraging additive manufacturing, and it enhances DeepCube's deep learning capabilities, Nano Dimension reports.
Subscription-Based Software: The New Normal?
August 11, 2023
Licensing models are slowly changing to be subscription based across the industry. But many organizations still use perpetual licensing.
Latest News
Matching Workstation to Workload
Finding just the right fit can be tricky but doable.
Meltio M600 Wire-Laser System Now Available
The combination of wire deposition, blue lasers, a large inert workspace, and smart sensors allow the new Meltio M600 to...
General Atomics Aeronautical Systems Adopts Siemens Xcelerator
GA-ASI is counting on ability to achieve marked productivity gains in the design of composite aerostructures by adding Siemens Xcelerator...
Embraer Picks Dassault Systèmes’ Simulation Technology
Company chooses this technology to support quieter eVTOL aircraft development for Eve Air Mobility, according to Dassault.
GE Aerospace Invests Sizably in Ohio
In addition to the investments, GE Aerospace is hiring more than 1,000 employees for open external positions at its U.S....
Ansys, Snack Giant Mars Partner for Digital Transformation
The multiphysics simulation technology minimizes the need for extensive physical testing during the packaging development process.
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