Molex Showcases Portfolio, New Products at DesignCon
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January 21, 2016
At this year’s DesignCon, Molex LLC showcased its NeoPress High-Speed Mezzanine System, the Impel Plus Backplane Connectors and High-Speed Low-Loss Circuit Assemblies. It also extensively demonstrated its current portfolio.
According to Molex, the NeoPress System solves these issues by providing compliant-pin termination while minimizing near-end and far-end crosstalk, matching the signal integrity of NeoScale SMT connectors. Moreover, the compliant pin allows designers to rework the board and maximize system utility without sacrificing signal integrity. System options include four triad configurations, high-speed single-ended traces and low-speed single-ended lines and power contacts. These options allow PCB designers to conserve PCB real estate by supporting low- and high-speed signals and power requirements with one compact connector.
“The modular system—with tunable differential pairs, low stack heights, and compliant-pin terminations with a staggered interface configuration—offers data rates up to 28Gbps,” said Nadine Dytko-Madsen, new product development manager, Molex. “That makes it ideal for new, space-constrained telecom, automation and medical applications that demand higher speeds and smaller form factors.” A mirrored interface allows compact stack height and simplified PCB routing.
The High-Speed Low-Loss Flex Circuit Assemblies are designed for electronic data transmission applications. The Impel Plus Backplane Connectors have data rates up to 56Gbps and include a grounding tail aligner for smaller signal compliant pins.
“Molex will focus on solutions that meet the most stringent high-speed performance requirements in the industry,” said Jairo Guerrero, director of marketing, enterprise business unit, Molex. “Our interconnect solutions also allow the flexibility and scalability required to meet the needs of next-generation system architectures.”
For more information, visit Molex.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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