Multiphysics Highlights ANSYS 14.5 Release

By Anthony J. Lockwood

ANSYS,  Inc. (Canonsburg, PA) has announced the availability of version 14.5 of its ANSYS 14.5 engineering simulation technology. The solution includes new multiphysics capabilities integrated with the ANSYS Workbench platform that the company says will enable improved engineering productivity and innovation. Additionally,  ANSYS 14.5 debuts its first chip-package-system design flow methodology for IC designers, ANSYS HFSS electromagnetic field simulation for ECAD design workflows,  as well as extended fluid-thermal capabilities.

ANSYS 14.5 provides a new Maxwell advanced hysteresis material modeling capability that,  says the company, can be used to analyze the magnetization and demagnetization of permanent magnets. Image courtesy of ANSYS, Inc.

The new multiphysics capabilities in version 14.5 are described as “seamlessly brought together with the ANSYS Workbench platform to deliver unmatched engineering productivity and innovation.” (ANSYS Workbench is the framework that supports the ANSYS suite of engineering technologies, and it also delivers capabilities for integrating native and third-party tools.) The update is said to deliver a number of new multiphysics solutions and enhancements to pre-processing and meshing capabilities, as well as a new parametric HPC (high-performance computing) licensing model to make design exploration more scalable.

ANSYS 14.5 HPC technology supports robust design exploration via a combination of Workbench’s enhanced parametric simulation technology with improved job management and the new HPC Parametric Pack licensing solution, which enables scalable throughput computing. The HPC Parametric Pack, according to the company, amplifies the available licenses for individual applications (pre-processing, meshing, solve, HPC, post-processing) by enabling simultaneous execution of multiple design points while consuming just one set of application licenses.

ANSYS 14.5 offers new coupling of Esterel Technologies’ SCADE embedded software simulation solution with the ANSYS Simplorer multi-domain system simulator. The coupling is said to enable virtual validation of both the hardware and software components of power electronic and mechatronic systems. Image courtesy of ANSYS, Inc.

“It’s no secret that while today’s products are getting smarter, they’re also becoming more complex,” said Jim Cashman, president and CEO at ANSYS, in a press statement. “Having a holistic view of the product requirements and design is crucial to reduce design uncertainty and ultimately create a successful product. Our customers are depending on the depth and breadth of ANSYS 14.5 and our Workbench platform to confidently predict how their products will perform and, at the end of the day, provide good value and satisfaction to their customers.”

Version 14.5 introduces its first chip-package-system (CPS) design flow” an integrated analysis and verification methodology for the design of electronic chips,  packages, and systems. CPS, explains ANSYS, is a coupled approach that addresses multidisciplinary requirements from the first phase of the design process, and results in a final product whose individual components work together as an integrated system.

ANSYS screen shot of a shape optimization of a manifold. For reduced pressure drop,  push red areas in and pull blue areas out. Image courtesy of ANSYS, Inc.

ANSYS 14.5’s CPS design flow links ANSYS subsidiary Apache Design‘s IC power analysis products to ANSYS’ electromagnetic field simulation products. Additionally, the power delivery network channel builder automatically connects electronic package models from ANSYS SIwave to IC power simulations in Apache’s RedHawk dynamic power integrity solution and Totem full-chip power and noise platform for analog and mixed-signal designs.

ANSYS TGrid functionalities are integrated in the ANSYS Fluent environment in version 14.5, which are said to further reduce pre-processing time. CAD readers and new advanced surface meshing capabilities are also integrated and available in a single user environment. Additionally, meshing enhancements allow for higher-quality hexahedral meshes that result in smaller problem size and overall reduced solver time, according to the company.

The 14.5 solution introduces extended fluid-thermal capabilities, such as two-way coupling between fluid simulation in ANSYS Fluent and electromagnetic field simulation in ANSYS Maxwell. The ANSYS Workbench platform supports the coupling of multiple physics models and, when paired with this new feature, users can quickly and accurately predict losses and understand the effects of temperature on material performance in electromechanical devices such as motors and transformers, the company says.

Global stress results on composites pressure vessel. Image courtesy of ANSYS, Inc.

ANSYS says that with the integration of recently acquired subsidiary Esterel Technologies’ SCADE embedded software simulation suite with ANSYS Simplorer multi-domain system simulator in version 14.5, companies can virtually validate power electronic and mechatronic systems earlier in the design process by simulating the embedded software with the hardware, including electrical, mechanical, and fluidic subsystems.

ANSYS 14.5 also sees the introduction of ANSYS HFSS for ECAD design workflow. The ANSYS HFSS for ECAD capability enables engineers to run complex 3D HFSS electromagnetic field simulations directly from the ANSYS Designer layout-based interface and from other popular layout-based ECAD environments.

For more information, visit ANSYS.

Watch a video on the ANSYS HPC Parametric Pack.

A schedule of live and rebroadcast ANSYS 14.5 webinars is available here.

Visit the ANSYS resource library.

Check out the ANSYS blog.

See why DE’s editors selected ANSYS 14.5 as their Pick of the Week.

Sources: Press materials received from the company and additional information gleaned from the company’s website.