Supermicro Delivers Multi-Node Liquid-Cooled Architecture

Systems deliver compute-density in a multi-node form factor with dual CPUS up to 500W each per node.

Systems deliver compute-density in a multi-node form factor with dual CPUS up to 500W each per node.

FlexTwin is built to support high-performance computing (HPC) workloads. Image courtesy of Supermicro.


Supermicro, Inc. announces the new FlexTwin family of systems. Featuring flexible support for the latest CPU, memory, storage, power and cooling technologies, FlexTwin is built to support high-performance computing (HPC) workloads. These systems are cost-optimized for performance per dollar and can be customized to suit specific HPC applications and customer requirements thanks to Supermicro's modular Building Block Solutions design.

“Supermicro's FlexTwin servers set a new standard of performance density for rack-scale deployments with up to 96 dual processor compute nodes in a standard 48U rack,” says Charles Liang, president and CEO of Supermicro. “At Supermicro, we're able to offer a complete one-stop solution that includes servers, racks, networking, liquid cooling components, and liquid cooling towers, speeding up the time to deployment and resulting in higher quality and reliability across the entire infrastructure, enabling customers faster time to results.

Also, reportedly, up to 90% of the server generated heat is removed with the liquid cooling solution. For more information about FlexTwin systems, visit here.

This new multi-node design incorporates Supermicro's modular Resource Saving Architecture, which uses shared power supplies and DLC (downloadable content) of critical components to reduce raw materials usage, maximize power efficiency, and lower data center PUE (Power Usage Effectiveness). The new FlexTwin architecture includes new and industry standard technologies.

More Features

  • Support for the latest generation of high-frequency CPUs up to 500W with DLC enabling compute densities unachievable with traditional data center air cooling
  • Multi-vendor CPU support with up to 12 memory channels per CPU
  • Front-accessible hot-swap compute nodes, I/O ports, and optional drive bays to enhance serviceability and simplify maintenance from the cold aisle
  • Enhanced reliability with redundant power supplies and hot-swappable liquid cooling pumps to minimize downtime
  • Optimized total rack level solutions for in-row and in-rack liquid cool deployments

To support the deployment of the FlexTwin architecture at scale, Supermicro offers rack-scale integration services to design, build, validate, and deliver complete solutions of any size thanks to a manufacturing capacity of up to 5,000 racks per month (including 1,350 liquid cooled racks), rack-scale integration and testing facilities, and a suite of management software solutions.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Share This Article

Subscribe to our FREE magazine, FREE email newsletters or both!

Join over 90,000 engineering professionals who get fresh engineering news as soon as it is published.


About the Author

DE Editors's avatar
DE Editors

DE’s editors contribute news and new product announcements to Digital Engineering.
Press releases may be sent to them via [email protected].

Follow DE
#29424