Mentor Graphics Launches New T3Ster DynTIM Tester

Provides thermal interface material measurement methodology.

Provides thermal interface material measurement methodology.

By DE Editors

Mentor Graphics announced the new T3Ster DynTIM tester, a method of measuring thermal characteristics of thermal interface materials (TIM). Thermal resistance testing of interface layers within electronics products is critical for product performance,  but the characterization of these thin, high-thermal conductivity materials under realistic conditions for their application is extremely challenging using current methods, the company says. The DynTIM tester provides the ability to control and vary the sample thickness of materials being tested, yielding very accurate results. It can be used with the Mentor FloTHERM and/or FloEFD CFD solutions.

The DynTIM tester, combined with the company’s T3Ster test product, an accurate method of measuring thermal resistance of TIMs under conditions close to real life applications on a variety of materials at different pre-set thickness levels, such as greases, pastes,  phase-changing materials and even specially prepared metallic samples. On average, the DynTIM tester provides TIM measurement accuracy by ±5%.

DynTIM users can test a large number of different TIMs to create a short-list of the best performing materials as possible candidates for the application. After the measurement of the material properties and narrowed selection of the TIMs, the T3Ster tester can be used to test these materials in-situ, in their target environment.

For more information, visit Mentor Graphics.

Sources: Press materials received from the company and additional information gleaned from the company’s website.


Share This Article

Subscribe to our FREE magazine, FREE email newsletters or both!

Join over 90,000 engineering professionals who get fresh engineering news as soon as it is published.


About the Author

DE Editors's avatar
DE Editors

DE’s editors contribute news and new product announcements to Digital Engineering.
Press releases may be sent to them via [email protected].

Follow DE
#3107