uPI Leverages Ansys’ Multiphysics Tools for Chip Design

uPI Semiconductor Corp. (uPI) applies Ansys' simulation solutions to speed up design for its product packaging solutions and improve thermal reliability. uPI is a supplier of semiconductor power management chips for high-performance computing (HPC) applications, communications hardware, battery management, industrial equipment and consumer products.

By leveraging Ansys simulation, uPI can predict the electrical, mechanical and thermal characteristics of its high-performance chip package designs with predictive accuracy, Ansys reports. This leads to improved product performance, streamlined design, and reduced risk of late-stage design changes, Ansys adds. Using Ansys to analyze heat flow and thermomechanical stresses, uPI optimizes their package designs and increases thermal reliability. Products that initially failed after 500 thermal test cycles were optimized with Ansys solutions to endure more than 1,000 cycles.

Ansys simulation tools also predict the electrical characteristics of packages across a range of signal frequencies, which helps uPI engineers identify optimal design solutions and improve product performance.

“Chip package design involves complex, multidimensional engineering that is nonlinear and can behave unexpectedly, even for small changes,” says John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. “Ansys' simulation tools provide end-to-end multiphysics analyses that enable teams to gain insight quickly into multiple areas of chip packaging with predictive accuracy. With Ansys, uPI is able to maximize their R&D and reliability testing processes to achieve high-quality products.”

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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