LEDAS Ltd. Updates LGS 3D to V1.4

By DE Editors

LEDAS Ltd.’s (Novosibirsk, Russia) new release of its LEDAS Geometric Solver (LGS 3D) now supports 3D, feature-based parametric design of parts and assemblies in CAD systems, in addition to kinematics modeling. The 3D geometric solver, a computational software module, has been updated to version 1.4, said to be more rapid than previous versions of LGS 3D. Due to efficient optimization of the core computational techniques, user functions execute faster, the company says, when measured on a large industrial test base of more than 3,000 cases.

The main advantage of the new 1.4 release is performance of the Move Under Constraint functionality, which is accelerated up to 7X due to the new heuristics implementation. Plus, new LGS 3D API functions that enable storing and restoring LGS 3D context to/from a file or a binary data array are provided. API functions for tolerance management are introduced also.

The company says geometric modeling and virtual reality systems benefit from integration with LGS 3D, as well as other applications that require logical and parametric connections or constraints to be managed between geometric objects in a 3D environment.

The Lege’n'd 3D demo application is moved to OpenCASCADE 6.2 version and can now export models to IGES/STEP formats. A new set of samples of parameterized mechanisms is added to the demo installation set to simplify LGS 3D evaluation. These advantages, coupled with affordable pricing, make LGS 3D suitable for CAD/CAM/CAE parameterization. The ability to set parametric constraints eliminates the need for exact drawing by designers because the constraints have the ability to render a sketch into an exact design. Other benefits of this functionality include simplification of process of model modification and the ability to carry out a simple kinematical analysis of the model.

For details,  go to LEDAS Ltd.

Sources:  Press materials received from the company and additional information gleaned from the company’s website.