C3Nano Unveils Conductive Curing Printable Ink Solution

C3Nano, Inc., provider of nanowire-based technologies and conductive inks, shares the development of SuperGrid, an ink that combines conductivity and flexibility with room temperature processing—an extension of C3Nano’s ActiveGrid LT (low temperature) ink series that was announced in 2022.

C3Nano’s SuperGrid has electrical properties similar to conductive electrodes like thin film copper and silver pastes, but is more flexible. It can be deposited directly from solution and can be cured very quickly (in ambient temperature ~25 °C within seconds). SuperGrid can be deposited on a broader range of substrates and through various methods.

Customers can use SuperGrid for bezels, microLED interconnects, grounding, traces around sharp/3D surfaces and EMI and RF shielding applications. Additionally, the low-temperature process gives users more design flexibility, higher throughput, and lower production costs. Compared to other low temperature processed inks, SuperGrid is stable at room temperature and only forms the conductive film or circuit after deposition.

“With SuperGrid, we are introducing a product that is more versatile through our low temperature curing process. Its enhanced flexibility will create unprecedented new product and market opportunities for our electronic device, biomedical, automotive, and display customers,” says  Xiqiang Yang, vice president of Research & Development at C3Nano.

C3Nano foresees large opportunities for the application of SuperGrid, especially in advanced displays and interconnects, semiconductor packaging, electronic and RF component shielding. 

C3Nano’s ActiveGrid LT innovation is part of its conductive materials platform composed of nanowires, nanomaterials, formulations, thin films and coatings.

Partner Development Platform 

As part of the development of SuperGrid and the launching of Ultra-Nanowires product line C3Nano is seeking customers and development partners for its Ultra-Nanowires technologies. C3Nano believes several applications including heating, direct conductive filler inclusions into melt/extrusion plastics, conductive adhesives and composites, 3D printing, biomedical, and aerospace may be viable applications.

Sources: Press materials received from the company and additional information gleaned from the company’s website.