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ThinkPad X1, Lenovo Go Power Hybrid Working
Lenovo unveils an array of product offerings at CES 2023, including the updated ThinkPad X1 portfolio.
Intel Debuts Fast Mobile Processor
New 13th Gen Intel Core mobile processors drive performance for more than 300 laptop designs, company says.
AMD Unleashes HPC Product Portfolio
AMD Ryzen 7000 Series Mobile processors deliver performance for demanding workloads with up to 16 “Zen 4” cores and bring new Ryzen AI technology to select laptop devices, company notes.
Uniformity Labs Unveils Stainless Steel Powder
Powder offers better mechanical properties at higher throughput for laser powder bed fusion, according to the company.
Formlabs’ Automation Ecosystem to Enable Automated 3D Printer Fleets
Form auto, fleet control software and high-volume resin system enables users to increase 3D printing output.
KIMYA Extends Range of 3D Filaments with Kimya PC-FR (Flame Retardant)
There are more than 25 filaments that KIMYA—with the help of its resellers—distributes in about 20 countries.
What’s New in Simcenter Flotherm and Simcenter Flotherm XT 2210 Software
Model navigation, geometry selection and manipulation for large complex models is now faster and easier.
Nematx Launches NEX 01 Liquid Crystal Polymer 3D Printer
The NEX 01 is powered by a motion control system and slicing algorithm that lend it micron-resolution 3D printing capabilities.
Authentise Debuts Flows & FlowsAM
Rebranded data-driven workflow management suite now available for additive and agile production environments.
Coreform Cubit 2022.11 Now Available
Product release features enhancements to core workflows, including meshing, geometry modification and import/export.
Data Conversion from the Mechanical CAD System to BIM
Bridging two different CAD systems, CAD-to-BIM Translator transfers models and their properties from one format to another.
Wohlers Associates Publishes Specialty Report on Additive Construction
Use cases from key market players are presented as examples of AC.
Quick Electromagnetic Analysis of PCB Design
Autodesk Fusion 360 Signal Integrity Extension by Ansys reduces costs and improves compliance.
What’s New in Teamcenter Product Cost Management
Following are a few of the highlights of Teamcenter Product Cost Management version 9.6.
QuadriSpace Debuts Document3D Suite 2023 for 3D Publishing
By repurposing existing 3D CAD files and associated data, customers can rapidly create technical documentation and illustrations.



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Hexagon Launches HxGN Alix
Company says new AI-powered assistant to assist industrial enterprises in digitally transforming heavy asset operations.

Siemens Releases AI-Augmented Electronic Systems Design Software
Latest release combines Xpedition, Hyperlynx and PADS Professional software via unified user experience with cloud connectivity and collaboration, company reports.

Siemens and Microsoft Deliver AI-Boosted NX X to Azure
Collaboration designed to deliver AI-based natural language assistance to NX X to automate design tasks for experienced users and bring...

EOS Debuts New Alloys for Metal Additive
Nickel-based superalloys target turbomachinery, chemical, maritime and space applications.

HP Partners with ArcelorMittal on Additive Manufacturing Plans
By combining HP’s expertise in printing with ArcelorMittal’s leadership in sustainable steel solutions, the collaboration aims to promote...

A GPU Revolution in Discrete Element Method Applications
Learn about the impact of GPU acceleration on DEM simulations from real-world users at the ATCx Discrete Element Method event....

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