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Ansys Launches Fluent Web UI
February 9, 2024
Fluent Web UI provides an interface for Ansys Fluent, a computational fluid dynamics solver with native graphics processing units.
Spatial Debuts Data Prep for CAD
February 9, 2024
Data Prep is Spatial’s newest add-on product for 3D InterOp.
AMD Debuts Embedded+ Architecture to Enhance Edge AI
February 6, 2024
The single integrated board is scalable and power-efficient, the company notes.
Ansys Introduces 2024 R1
February 6, 2024
Combined with an open architecture, 2024 R1 streamlines engineering workflows.
Elementum 3D Launches High-Strength Aluminum Alloy
February 6, 2024
Material designed to eliminate need for heat treatment.
Launching the Revopoint MINI 2 3D Scanner
February 2, 2024
The updated Revopoint MINI 2 3D scanner provides professional-level ultra-detailed small object scanning capabilities.
ASUS Launches Zenbook DUO in Canada
February 2, 2024
In addition to the twin ASUS Lumina OLED displays, a detachable snap-on magnetic keyboard and kickstand are bundled into one compact, user-centric design. 
PolySpectra NETHING.XYZ Aims to Democratize 3D Printing
February 2, 2024
neThing.xyz aims to make the process of creating 3D CAD models more accessible.
KISTERS 3DViewStation Enhanced
February 2, 2024
3D and 2D graphics improve interactions between customers and companies.
nCode 2024.0 Now Available
February 2, 2024
Look for  improvements in functionality and performance in latest release.
AMPro Sieve Station Connect Launched
January 30, 2024
The AMPro Sieve Station Connect is designed to provide optimum powder convey times and sieving efficiency, the company reports.
Stronger Parts at the Click of a Button
January 30, 2024
Markforged Performance Advisor automatically analyzes a part and recommends print settings that improve strength while keeping costs low.
EON Marketplace Unveils 800-Plus Immersive Courses
January 29, 2024
The EON Marketplace reportedly seeks to foster an engaging, effective and accessible learning environment through AI-tailored course recommendations. 
Siemens Delivers Thermal Digital Twin Technology
January 26, 2024
High-fidelity thermal simulation data can be shared in the electronic supply chain while protecting semiconductor OEM’s intellectual property, according to Siemens.
Keysight Launches Chiplet PHY Designer
January 26, 2024
New product leverages Keysight EDA’s technology and history of success simulating complex physical layer standards such as SerDes and memory.



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