DE · Topics · Test · Test

WIN Enterprises Announces 3.5-Inch SBC with AMD Embedded G-Series SOC

Includes L2 cache and DDR3 memory controller.

Includes L2 cache and DDR3 memory controller.

WIN Enterprises announced the MB-60830, a 3.5-in. SBC featuring the new AMD Embedded G-Series SoC with integrated chipset and discrete-class AMD Radeon Graphics Processing Unit.

From a usage standpoint, the new 28nm processor is a single-chip solution that can be used on boards like MB-60830 to accelerate 3D graphics, as well as to support more generalized embedded computing applications, the company says.  Applications can span digital signage, gaming, medical imaging, kiosks/POS, thin client and factory automation.

In addition to its integrated chipset and AMD Radeon 8000 Series graphics, the AMD Embedded G-Series SoC integrated components include L2 cache and a DDR3 memory controller. The platform also includes enterprise-class Error-Correction Code (ECC) memory support, industrial temperature range of -40 °C to +85 °C, and is available with dual or quad-core CPUs based on AMD’s next-generation Jaguar architecture.

For more information, visit WIN Enterprises.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

Share This Article

Subscribe to our FREE magazine, FREE email newsletters or both!

Join over 90,000 engineering professionals who get fresh engineering news as soon as it is published.


About the Author

DE Editors's avatar
DE Editors

DE’s editors contribute news and new product announcements to Digital Engineering.
Press releases may be sent to them via [email protected].

Follow DE
#740