TSMC Certifies Ansys Multiphysics Platforms

Ansys multiphysics platforms support TSMC's latest silicon technologies, enabling advanced semiconductor designs.

Ansys multiphysics platforms support TSMC's latest silicon technologies, enabling advanced semiconductor designs.

TSMC and Ansys join forces to enable faster, lower power semiconductor designs, organizations report. Image courtesy of Ansys.

Ansys reports the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering speed and power for high performance computing, mobile chips, and 3D-IC designs. RaptorX is now certified for TSMC's N5 technology — crucial for modeling on-chip electromagnetic integrity in radio frequency systems, 5G, telecommunications, datacenters and 3D-IC heterogeneous silicon systems.

Ansys has also collaborated with TSMC on an AI-enabled analysis optimization flow using Ansys optiSLang and Ansys multiphysics solutions, including RaptorX, RedHawk-SC and RedHawk-SC Electrothermal.

“The significant power and performance boost delivered by our most advanced 2nm process technology is driving customers' needs for accurate and comprehensive multiphysics analysis,” says Dan Kochpatcharin, head of design infrastructure management division at TSMC. “Our latest collaboration with Ansys delivers power integrity solutions for our most advanced process technologies that are pivotal to enable customer designs, and we have extended our partnership with Ansys to include RaptorX to manage the growing influence of electromagnetic effects in high-speed circuits.”

“The Ansys multiphysics platform boasts strong technical solutions for power integrity and high-speed electromagnetics,” says John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. “Our collaboration with TSMC empowers our joint customers with the most advanced multiphysics simulations and analyses, enabling them to design some of the most innovative and advanced chips in the world.”

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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