Siemens Delivers Thermal Digital Twin Technology
High-fidelity thermal simulation data can be shared in the electronic supply chain while protecting semiconductor OEM’s intellectual property, according to Siemens.
January 26, 2024
Siemens Digital Industries Software is bringing an approach for sharing accurate thermal models of integrated circuit (IC) packages to the electronics supply chain. The main advantages are protecting intellectual property, enhancing supply chain collaboration and accuracy of models for steady state and transient thermal analysis to enhance design studies, according to Siemens.
Introduced in the latest updates to Simcenter Flotherm software for electronics cooling simulation from the Siemens Xcelerator portfolio of industry software, the Embeddable Boundary Condition Independent Reduced Order Model (BCI-ROM) technology allows a semiconductor company to generate an accurate model that can be shared with clients for use in downstream high-fidelity 3D thermal analysis without exposing the IC’s internal physical structure, according to Siemens.
“Given electronics supply chain pressures and the growing complexity of IC packages, barriers to collaboration and thermal analysis efficiency during design must be eliminated where possible to support competitive development,” says Jean-Claude Ercolanelli, senior vice president, Simulation and Test Solutions, Siemens Digital Industries Software.
“Our breakthrough new technology enables accurate thermal models to be shared securely within the electronics supply chain without exposing sensitive intellectual property, allowing all parties to resolve thermal issues faster and bring advanced products to market more quickly,” Ercolanelli adds.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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