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MEMSIC Releases New Two-Axis Digital Accelerometer

New accelerometer features monolithic design, wafer-level packaging and thermal MEMS-based design.

New accelerometer features monolithic design, wafer-level packaging and thermal MEMS-based design.

By DE Editors

MEMSIC Inc. systems has announced the availability of its MXC6226XC MEMS two-axis digital MEMS accelerometer. Based on MEMSIC’s MEMS thermal technology, it is manufactured using a standard 0.18um CMOS process and wafer-level packaging (WLP).

According to the company, the MEMSIC MXC6226XC digital accelerometer is the smallest production accelerometer. It measures 1.2 x 1.7 x 1 mm. Its small size and availability in a ball grid array (BGA) package provides designers flexibility for integration into space-constrained designs, according to the company.

The MXC6226XC integrates signal conditioning circuitry, including a DSP, to enable motion sensing performance. Since it is based on MEMSIC’s thermal accelerometer technology, which has no moving internal structures, MEMSIC says the MXC6226XC exhibits high shock survivability (up to 50,000g).

The MXC6226XC Digital Accelerometer can detect four orientation positions, offers shake detection and can measure acceleration over a +/- 2 g range with an absolute 0 g offset of less than +/- 50 mg, according to the company. Operating voltage is 2.5 v to 5.5 v. It operates over a -20 to +70 degree C. temperature range.

For more information, visit MEMSIC.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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