Cadence Unveils Clarity 3D Solver

Cadence Design Systems, Inc. has entered the system analysis and design market with the launch of the Cadence Clarity 3D Solver. Harnessing distributed multiprocessing technology, the Clarity 3D Solver tackles electromagnetic (EM) challenges encountered when designing complex 3D structures on chips, packages, PCBs, connectors and cables. The Clarity 3D Solver reads design data from all standard chip, IC package and PCB implementation platforms while also providing integration benefits for design teams using the Cadence Allegro and Virtuoso implementation platforms. 

Clarity 3D Solver technology addresses complex EM challenges faced when designing systems for 5G communications, automotive/advanced driver assistance systems, high-performance computing and IoT applications. Cadence distributed multiprocessing technology enables the Clarity 3D Solver to deliver unlimited capacity and a 10X speed-up required to efficiently and effectively address these larger and more complex structures. The Clarity 3D Solver creates accurate S-parameter models for use in signal integrity (SI), power integrity (PI) and electromagnetic compatibility (EMC) analysis, the company reports.

The Clarity 3D Solver is optimized to distribute a job across multiple low-cost computers while remaining equally efficient when running on a more expensive server with terabytes of memory. A distributed adaptive meshing approach and smaller memory requirements than legacy 3D field solvers enable the Clarity 3D Solver to extensively use cost-effective cloud and on-premises distributed computing. 

Using the Clarity 3D Solver in conjunction with the Cadence Sigrity 3D Workbench, users can merge mechanical structures such as cables and connectors with their system design and model the electrical-mechanical interconnect as a single model. The Clarity 3D Solver is also tightly integrated with the Virtuoso, Cadence SiP Layout and Allegro implementation platforms, enabling 3D structures to be designed in the Allegro and Virtuoso environments, optimized in the analysis tool and implemented in the design tool without being redrawn.

“Our newly formed System Analysis Group is breaking new ground on next-generation algorithms to solve the most difficult electromagnetic challenges across ICs, packages, boards and complete systems,” says Tom Beckley, senior vice president and general manager of the Custom IC & PCB Group at Cadence. “With the Clarity 3D Solver, semiconductor and systems companies can address system-level problems for a broad spectrum of today’s most challenging applications including 112G communication networks, IoT, automotive/ADAS, and other complex high-speed electronic systems.”

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Sources: Press materials received from the company and additional information gleaned from the company’s website.

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