3D Collaboration & Interoperability Congress Details Released

Longview Advisors' CIC conference scheduled for May 23-25 in Denver.

Longview Advisors' CIC conference scheduled for May 23-25 in Denver.

By DE Editors

Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (CIC), have announced a new, special forum for executive management in conjunction with the 2011 event, to be held May 23 to 25 in Denver. The new Management Forum will cover topics of particular interest to executives managing processes and people for more effective global collaboration in product development and manufacturing.

The following topics are currently on the agenda for this year’s forum:

  • Teamwork, Social Computing and Their Impact on Simulation DrivenDesign?
  • Managing the Braindrain Threat from Boomer Retirement
  • Irreconcilable Differences? Getting Engineers from DifferentGenerations To Work Together
  • Mashups: A Killer App for Engineers?
  • Is PDM-Less PLM Pragmatic or Problematic?
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This first year’s Management Forum will be hosted by Chad Jackson who has more than 15 years of experience in the industry.

“I’m excited to host the new Management Forum at CIC,” says Jackson, president of Lifecycle Insights Inc. “There are a lot of issues that are mission-critical to executives managing organizational performance. Our new forum is targeted squarely at these types of issues.”

The CIC lineup of speakers for the 2011 event have also been announced. The program is highlighted by the following presentations and panels of industry experts:

  • Challenges and Solutions in Development and Design, Dick Morley, Director of Innovation, Cyon Research; Founder, “The Barn”
  • Countering the Braindrain Threat to Engineering by Kiho Sohn, (former) Chief Knowledge Officer, Pratt & Whitney Rocketdyne
  • Accelerating Innovation in Today’s Engineering Organization by Chad Jackson, President and Founder of Lifecycle Insights
  • Overview & Status of Model-Based Enterprise (MBE) Standards by Ric Norton, Program Manager and Technical Data Analyst for the Defense Logistics Agency (DLA) Logistics Information Service
  • If You Build It, Will They Come?” PMI from the other side by John Callen, Product Manager, Inventor PLG, Manufacturing Industry Group, Autodesk
  • Update on Global LOTAR Status, Activities and Solutions by Rick Zuray, Technical Principal, Boeing
  • Using Standards & Visualization formats to Implement 3D Manufacturing Instructions for Long Term Data Archiving by Trevor Leeson, Consultancy & Services Director, Theorem Solutions
  • Trends and Best Practices in Collaboration & Interoperability: Results from the Sixth Annual Survey by Dr. David Prawel, President, Longview Advisors Inc.
  • Making 3D Product Data Cheap and Available - Added Value with JT and STEP by Dr. Andreas Schreiber, President, PROSTEP Inc.
  • Incorporating STEP and Collaborative Formats Together into the Product Lifecycle by Dr. Nathan Hartman, Assistant Department Head, Department of Computer Graphics Technology, Purdue University; Philip Rosche, Senior Associate, ICF International; Kevin Fischer, Advanced Manufacturing Technology, Rockwell Collins
  • Integrated Product Development with CATIA V6 and SAP by Reinhard Staebler, Vice President” SAP Solutions, CENIT North America
  • Panel: Getting the Most From Your Engineering Organization
  • Exploring the Latest Technologies for Accelerating   Secure Collaboration by Wes Shimanek, Workstation Product Manager, Intel Architecture Group, with guests Nate Nalven, Director Engineering Applications at Northrop Grumman and Chuck Brown, Cloud Technology Director at Intel
  • Deploying PLM to Drive Enterprise Collaboration Standards by Rick Mihelic, Engineering Systems Manager, Peterbilt Motors Company
  • Model-Based Enterprise (MBE) Pilot Programs Overview & Status by Rich Eckenrode, President, Recon Services
  • Mitigating Risk in PLM Migration - A Tale of Transition by Vijay Vasandani, VP & GM, NobleTek
  • MBE PLM Technical Data Plan - Definition Update/Status by Roy Wittenburg, Project Manager for UTRS, US Army
  • Panel B: Empowering Engineering Decision Making
  • Automotive Industry Visualization Standards Based Interoperability: A Global Industry Initiative by Doug Halliday, Director - Strategic Business Development, Trubiquity
  • Leveraging Photorealistic 3D Web Applications in the Cloud for Supply Chain Collaboration by Phil Lunn, CTO, Bunkspeed
  • Open Source in PLM by Marc Lind, Senior Vice President, Aras
  • Panel: Collaboration & Interoperability Industry Update
  •  

A special workshop focusing on the Model-Based Enterprise (MBE) will cover topics of particular interest to engineering and IT managers who may be planning or implementing processes to drive a digital MBE/MBD vision for more effective global collaboration in product development and manufacturing.

The MBE workshop will be kicked off by Sanjay Parimi, ARDEC project officer, Materials, Manufacturing & Prototype Technology U.S. ARMY, ARDEC. Parimi’s presentation, “Unlocking Native 3D CAD and MBD Assets For Use in Downstream Interactive 3DPDF Manufacturing Documents,” will discuss reuse of 3D CAD and embedded Model-Based Definition (MBD) data in downstream manufacturing processes.

The following additional topics also will be presented in this year’s MBE Workshop:

  • MBE Dictionary” Provides definitions of MBE terms, condensedby the user community to enable use of consistent language when discussingMBE solutions. Presenter: Jennifer Herron, president of ActionEngineering.
  • MBE Standards Overview” Provides an overview of various MBEStandards that the DoD Engineering Drawing and Modeling Working Group usesto drive Technical Data requirement deliverables in Government Contracts.Presenters: Paul Huang, project lead for Army Research Laboratory inModel-Based Enterprise Programs, and Ric Norton, Program Manager andTechnical Data Analyst for the Defense Logistics Agency (DLA) LogisticsInformation Service.
  • MBE Pilot Programs” Provides a review of past and currentMBE pilot programs, including the transition into production of MBE andMBD methods for manufacturing planning. Presenter: Rich Eckenrode,president of Recon Services, who brings more than 35 years of experiencein manufacturing engineering and operations organizations, and is heavilyinvolved with MBE-related initiatives, including several Design ForManufacturability projects in vehicle structure design.
  • MBE PLM Technical DataPackage Definition Update/Status“Provides insights on standardizing electronic data for reuse anddelivering it electronically. Presenter: Roy Whittenburg, project managerfor Universal Technical Resource Services who currently supports both theArmy’s Armament Research, Development and Engineering Center (ARDEC) andthe Army/OSD Mantech’s Model-Based Enterprise activities.
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Full abstracts and bios for each presentation are available on the CIC website, along with comments from past attendees, and free access to all presentations and audios from the 2010, 2009 and 2008 events.

Now in its eighth year, the annual CIC brings together experts and executives from a range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business.

For more information, visit the 3D Collaboration & Interoperability Congress site.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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