Ping Golf Uses CAE and HPC for Virtual Prototyping
August 8, 2019
Eric Morales, senior research engineer at PING Golf, explains how combining CAE simulation with the latest HPC technology has greatly reduced product development time.
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3D Systems Delivers 3D Printing Products at Formnext
Also, Figure 4 Rigid Composite White & Accura AMX Rigid Composite White features high resolution, high stiffness parts.
Ansys and IonQ Deliver Usher in Quantum Computing to CAE Industry
Two companies partner to enhance engineering simulation through advanced quantum computing.
Jon Peddie on Milestone Moments in the History of CAD
Interview with Jon Peddie, President of JPR, on the new ebook on the history of modern CAD
Henkel to Show AM Materials at Formnext 2024
The company unveils a high-performance resin and highlights a recent add-on to its medical portfolio.
America Makes Welcomes New Workforce Development Director
He is responsible for providing strategy and program management leadership in education and workforce development for customer project initiatives, according...
Stratasys to Show GrabCAD IoT Platform at Formnext 2024
Software solution generates real-time insights and enhanced connectivity for boosting uptime, according to Stratasys.
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New & Noteworthy
New & Noteworthy: Future-Proof Foundation for Employee Training and Education
Eagle Point Software's Peak Experience for Pinnacle Series adds AI chat, improved...
Eliminate Physical Clamping – With Simulation
The Virtual Clamping tool in ANSA (VCA) from BETA CAE Systems eliminates...
New & Noteworthy: Fast, Flexible and Scalable Simulation – In the Cloud
Ansys Access on Microsoft Azure enables seamless deployment of industry-leading simulation tools...
New & Noteworthy: Safe, Cost-Effective Metal 3D Printing - Anywhere
Desktop Metal’s Studio System offers turnkey metal printing for prototypes and...