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nano3Dprint Releases Upgraded A2200 3D Multi-Material Electronics Printer
nano3Dprint, additive manufacturing solutions provider, has released its upgraded A2200 3D multi-material electronics printer.
Hexagon Debuts System-Level Modeling Solution
Using the software, teams can evaluate the performance and feasibility of new design concepts quickly to inform more efficient product development, company notes.
BETA CAE Systems Releases v23.0.2 of its Software Suite
v23.0.2 is addressed to those that would like to delve deeper into v23.x.x potential, including a range of upgrades and performance improvements.
What’s New in Arnold?
Autodesk product enables optimization of rendering and much more.
COMSOL Releases Version 6.1 of COMSOL Multiphysics
COMSOL is strengthening its multiphysics simulation platform with new capabilities for product development and innovation anchored in the laws of science.
Meltio Unveils New Solutions
Meltio enables use of wire-laser metal 3D printing technology, according to the company.
SLM Solutions Presents Innovation for Producing Large-Scale Metal Parts
The solution will enable production of high-quality metal parts up to a size of 3.0x1.2x1.2 meter (LxWxH), SLM Solutions reports. 
BETA CAE Releases SPDRM v1.7.2
This version delivers enhancements and fixes for the Simulation Process Data and Resources Management software, the company says.
CADEditorX 15 Released
Users can download a free 45-day trial version.
CETOL 6σ v11.3.0 3D Tolerance Analysis Software Available
CETOL 6σ v11.3.0 tolerance analysis software can define auxiliary features, and manage ignored messages and updated language features, company says.
MELD Unveils 3PO 3D Metal Printer
New printer combines additive and subtractive technology into one hybrid machine.
What’s New in Simcenter System Simulation 2210
New functionalities will help users model more complexity and improve integration, company says.
Nexa3D Expands Resin Portfolio
Resin portfolio now includes over 20 validated photopolymer materials for the NXE series and the XiP printer platforms.
Carbon Debuts New Damping Elastomers
EPU 43 and EPU 45 expand Carbon's idea-to-production platform and offer opportunities for breakthrough products in impact protection.
AMD Brings 4th-Gen AMD EPYC Processors to Modern Data Center
AMD EPYC™ processors are supported by a complete cloud, enterprise, hardware and software ecosystem.



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Hexagon Launches HxGN Alix
Company says new AI-powered assistant to assist industrial enterprises in digitally transforming heavy asset operations.

Siemens Releases AI-Augmented Electronic Systems Design Software
Latest release combines Xpedition, Hyperlynx and PADS Professional software via unified user experience with cloud connectivity and collaboration, company reports.

Siemens and Microsoft Deliver AI-Boosted NX X to Azure
Collaboration designed to deliver AI-based natural language assistance to NX X to automate design tasks for experienced users and bring...

EOS Debuts New Alloys for Metal Additive
Nickel-based superalloys target turbomachinery, chemical, maritime and space applications.

HP Partners with ArcelorMittal on Additive Manufacturing Plans
By combining HP’s expertise in printing with ArcelorMittal’s leadership in sustainable steel solutions, the collaboration aims to promote...

A GPU Revolution in Discrete Element Method Applications
Learn about the impact of GPU acceleration on DEM simulations from real-world users at the ATCx Discrete Element Method event....

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