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Reverse Engineering
Leios Mesh now available as stand-alone product.
Nanocomposite for SLA
3D Systems introduces new temperature-resistant material.
Think3 Adds Reverse-Engineering Tool
Thinkreshape creates surfaces on point-cloud meshes.
Rapid Prototyping Service Expands to Europe
RedEye RPM opens facility for online RP orders.
Talking Touch Screens
Roland milling systems build 3D overlays for tactile tablets.
V-Flash Printer May Infringe on German Patents
3D Systems denies claim, says its patents are violated.
Paper Prototypes
Mcor Matrix builds 3D models from standard sheets of paper.
Stratasys Showcases Rapid Manufacturing Technology
New FDM 900mc features large build chamber, improved accuracy.
Metris Releases 7-Axis Articulated Arm for Lab or Shop Floor
The MCA is suited for both laser scanning and touch-probe sensor uses.
Microsoft Making HPC and Supercomputer Moves
Firm hires supercomputer genius.
Just Don’t Call it Cluster Server
Microsoft's latest revision of high-performance computing tool is due next year.
IBM: Let’s Get Small
Computer powerhouse unveils research that makes supercomputers super small.
USB 3.0 Looking For Experts
High-speed connect development group seeks outside guidance.
RapidMind Aims to Fill the Multicore Void
Firm now exploits both GPUs and multicore processors.
Wacom Expands Cintiq Interactive Pen Display
Cintiq 12WX and Cintiq 20WSX deliver pen-on-screen choices.



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