ANSYS Releases Engineering Knowledge Manager 13.0
Simulation process and data management software updated with new features.
article/ansys-releases-engineering-knowledge-manager-13-0Driving into 2014: Presidio Parkway’s Future Envisioned in 3D
FEA-Opt Technology Releases SmartDO 3.1
Design optimization system features enhanced user interface.
article/fea-opt-technology-releases-smartdo-3-1InnovMetric Software Announces New PolyWorksV12 Features
Integrates DirectReplay re-measurement technology into its 3D metrology platform.
article/innovmetric-software-announces-new-polyworksv12-featuresQLogic TrueScale InfiniBand Integrates with NVIDIA Tesla GPUs
QLogic and NVIDIA team with NCSA to achieve No. 3 ranking on Green500 HPC computing list.
article/qlogic-truescale-infiniband-integrates-with-nvidia-tesla-gpusSC11 Student Cluster Competition Now Open
Student teams who want to break a world record must enter by April 15.
article/sc11-student-cluster-competition-now-openIOSO to Sponsor FLOW-3D European Conference
Sigma Technology is participating in the 11th Annual FLOW-3D European Users Conference as a sponsor.
article/ioso-to-sponsor-flow-3d-european-conferenceASME International Gas Turbine Institute Announces Scholarship Program
Will award up to 10 $2,000 scholarships annually.
article/asme-international-gas-turbine-institute-announces-scholarship-programThe Coordinate Metrology Society Extends "Call for Papers" Abstracts Deadline
The 2011 Coordinate Metrology Systems Conference (CMSC) deadline for abstracts is now March 18.
article/the-coordinate-metrology-society-extends-call-for-papers-abstracts-deadlineHexagon Metrology Supplies Measuring System to Milwaukee Machine Works
Precision machining company enhances capability with Leitz PMM-G coordinate measuring machine.
article/hexagon-metrology-supplies-measuring-system-to-milwaukee-machine-worksIntel Expert Writes the Book on Embedded System
"Transitioning Embedded Systems to Intelligent Environments" being released by Intel Press.
article/intel-expert-writes-the-book-on-embedded-systemEurocom Adds Intel Xeon Processor X5690 to Panther 2.0 Mobile Servers and Mobile Workstations
Proessor provides more options for deploying short-term LAN-based solutions.
article/eurocom-adds-intel-xeon-processor-x5690-to-panther-2-0-mobile-servers-and-mobile-workstationsEMA Integrates Mouser’s Online Electronic Components Database with Cadence OrCAD Capture CIS
Version 4.1 of Component Information Portal provides direct download of Mouser part information onto the engineering desktop.
article/ema-integrates-mousers-online-electronic-components-database-with-cadence-orcad-capture-cisCCE’s EnSuite Enhanced with Tools for Reverse Engineering and Rapid Prototyping
New tools include model comparison, bounding volumes, surface area and more.
article/cces-ensuite-enhanced-with-tools-for-reverse-engineering-and-rapid-prototypingAVX Updates SpiTanIII Capacitor Simulation Software
Version 1.1 includes latest part numbers and file generators.
article/avx-updates-spitaniii-capacitor-simulation-softwareDesign & Simulation Software Guide 2024
The inaugural Digital Engineering Design & Simulation Software Guide is our first attempt to map the engineering software landscape, providing a list of key vendors in the market, organized by category. While there has been a significant amount of software vendor consolidation over the past several years, new…
download/design-simulation-software-guide-2024Special Focus Issue: Designing for Automotive
The automotive industry continues to embrace leading-edge product development technology in order to meet demand for electric and autonomous vehicles, and to meet new regulations. In this Special Focus Issue, our writers take a look at the latest advancements in automotive engineering, including how Formula 1 and other…
download/special-focus-issue-designing-for-automotiveDigital Engineering September 2024
Inside This Issue: DE Summit Highlights AI, Digital Twins, 3D Printing First speakers announced for Digital Engineering Design & Simulation Summit 2024. Road Trip: Will AI-Based Simulation Hit a Home Run? At NAFEMS Americas, technology leaders provide guidance on how artificial intelligence can enhance simulation workflows. Road Trip:…
download/digital-engineering-september-2024Accelerate workflows and increase efficiency with Velocity Micro’s professional class workstations
If your projects are being bottlenecked by inefficient and ineffectual PC hardware, Velocity Micro’s professional class workstations can directly accelerate your workflows to make your team more efficient. Common pain points include: Slow rendering and simulation times Incompatibility with advanced design software Challenges with handling large datasets (BIM,…
download/accelerate-workflows-and-increase-efficiency-with-velocity-micros-professional-class-workstationsDigital Engineering July/August 2024
Inside This Issue: The Race is On Designing for The America’s Cup Race When Boats Fly CFD helps boats grow wings and stay airborne. 3D Printed Vessels Set Sail From America’s Cup race teams to commercial boat manufacturers, the marine industry is navigating additive manufacturing in search of…
download/digital-engineering-july-august-2024Special Focus Issue: Design for Additive Manufacturing
The additive manufacturing industry has faced a number of challenges the past few years. Several major companies in the space have seen sales decline and gone through dramatic restructuring, while others have merged or been acquired. When we traveled to the Additive Manufacturing Strategies conference in New York…
download/special-focus-issue-design-for-additive-manufacturingAI-Powered Engineering
Artificial intelligence (AI) has rapidly risen to top priority for most enterprises, and engineering organizations are no different. In simulation, AI can potentially optimize and accelerate analysis, while helping improve design productivity. NVIDIA and Dell Technologies are at the forefront of AI development, particularly in the engineering space.…
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