Digital Engineering June 2024

In the June issue of Digital Engineering, learn about generative design applications and hardware requirements, what is new in AutoCAD 2025, simulation interoperability, digital twins, and hybrid manufacturing.

Inside This Issue:

Generative AI Enters Next Phase with Natural Language

It’s not about typing or shouting executable commands.

Generative Design Pushes Workstation Performance

The design process requires the right hardware to support higher data and simulation workloads.

Collaborative Simulation

Interoperability in simulation improves accuracy, reduces development times and fosters innovation. 

From CAD to Digital Twins to XR

Is a continuous digital thread possible or necessary?

CAM Meets AM to Enable Hybrid Manufacturing

Combining metal AM and CNC milling in a single hybrid system can give manufacturers a cost and flexibility advantage, but there are trade-offs.

Review: What’s New in AutoCAD 2025

Even more AI tools are added to the latest release of AutoCAD.

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Latest News

Simulating Manufacturing Mitigates Product Risk
A hallmark of modern design practices, simulation is now being applied to manufacturing process planning to boost product quality, drive...

Godiz Named a Meltio Service Bureau for Metal Additive Manufacturing
Specifically, Godiz is named a service bureau for wire-laser metal AM in Spain and Portugal.

GRAITEC Group Enhances Productivity Solutions for Autodesk Revit
Compatible with Revit 2025-2022, these tools are designed for enabling AEC firms to maximize their ROI, GRAITEC says.

Bentley Systems Acquires 3D Geospatial Company
The combo of Cesium, a geospatial company, plus iTwin can enable a comprehensive digital platform for the built and natural...

3DEO Secures Investment from Japanese Bank
Mizuho Bank is investing $3.5 million in 3DEO's Intelligent Layering technology and expertise in design for additive manufacturing, 3DEO reports.

Formlabs Expands its SLA and SLS Ecosystem
New hardware, software, and materials streamline post-processing.

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