Digital Engineering July/August 2023
The July/August issue of Digital Engineering focuses on innovations in electronics design, including cloud-based ECAD, electronic toy design, PLM for electronics, quality control in 3D printing, and a review of the BOXX APEXX S3 workstation.
August 1, 2023
Inside This Issue:
Subscription-Based Software: The New Normal?
Licensing models are slowly changing to be subscription based across the industry. But many organizations still use perpetual licensing.
SaaS Gains Ground in ECAD
Simulation drives ECAD to subscription.
Playful Magic and Functional Esthetics
Incorporating electronics to raise the bar for toys and accessories.
How Well Can PLM Support Electronics Developers?
Until now, PLM has made limited inroads into the electronics design and development sector.
Production-grade AM Gets Quality Boost
Advances in artificial intelligence, in-situ monitoring and process control are picking away at longstanding concerns about additive manufacturing part quality, but more work needs to be done.
Choosing the Right Computing Options for Enhanced Workflows
Getting the ideal hardware for your engineering applications isn’t just about the price tag.
Top Performance Winner: BOXX APEXX S3
The latest workstation from BOXX beats the performance of its predecessor.
Download today
Latest News
Simulating Manufacturing Mitigates Product Risk
A hallmark of modern design practices, simulation is now being applied to manufacturing process planning to boost product quality, drive...
Godiz Named a Meltio Service Bureau for Metal Additive Manufacturing
Specifically, Godiz is named a service bureau for wire-laser metal AM in Spain and Portugal.
GRAITEC Group Enhances Productivity Solutions for Autodesk Revit
Compatible with Revit 2025-2022, these tools are designed for enabling AEC firms to maximize their ROI, GRAITEC says.
Bentley Systems Acquires 3D Geospatial Company
The combo of Cesium, a geospatial company, plus iTwin can enable a comprehensive digital platform for the built and natural...
3DEO Secures Investment from Japanese Bank
Mizuho Bank is investing $3.5 million in 3DEO's Intelligent Layering technology and expertise in design for additive manufacturing, 3DEO reports.
Formlabs Expands its SLA and SLS Ecosystem
New hardware, software, and materials streamline post-processing.
All posts
New & Noteworthy
New & Noteworthy: Fast, Flexible and Scalable Simulation – In the Cloud
Ansys Access on Microsoft Azure enables seamless deployment of industry-leading simulation tools...
New & Noteworthy: Safe, Cost-Effective Metal 3D Printing - Anywhere
Desktop Metal’s Studio System offers turnkey metal printing for prototypes and...
New & Noteworthy: Direct Neutronics Analysis on CAD
Coreform Cubit 2023.11 workflows enable neutronics directly on CAD for next-generation nuclear energy...
New & Noteworthy: Agile Engineering Collaboration
Authentise Threads is a new software tool for distributed communications and project...