Digital Engineering April 2024

In the April 2024 issue of Digital Engineering, learn about the latest trends in additive manufacturing, securing design IP, and digital twin security.

Inside This Issue:

DfAM: Nine Best Practices

Here are nine tips to boost your design for additive manufacturing approach. 

Securing Design IP in Distributed Manufacturing

Decentralized production models increase security and risk exposure of standard design intellectual property and additive manufacturing process parameters and recipes. 

Ask Your AI: Doomed to Fail or Designed to Print? 

Solution providers turn to machine learning to reduce print failure.

Power of Good Design 

Applying emphasis on effective and innovative design processes in the design for additive manufacturing space can pay off and trim costs in the long run.

Digital Twin: Balancing Access and Security

PLM offers clues to managing the competing demands of digital twin users.

Rackable Systems Display Power and Performance

Scalability and space efficiency are just a couple benefits of the special breed of workstations. By Randall Newton

Review: A New Price/Performance Leader - Lenovo ThinkStation P5

A bold new design and great performance make this new Lenovo workstation a winner.

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Latest News

NVIDIA AI Summit: AI Powers Everything, from Autonomous Cars to the Search for Alien Life
NVIDIA's Bob Pette credits Tensor Cores and CUDA as the catalysts for AI revolution

MachineWorks and Productive Machines Ink Strategic Partnership
This collaboration aims to introduce efficiency in machining processes, the companies report.

OpenBOM Releases Major Update for Onshape
Look for new drawing features, simplified settings, and enhanced speed, company says.

Altair and Munich Technical School Partner on Quantum Computing
Research details solutions for several key challenges of quantum computing implementation.

@Xi Delivers AI Supercomputer to University of Wyoming
Not counting the CPU nodes, this new supercomputer power reaches up to 6.3 PetaFLOPS FP64/32 peak performance.

Ansys Teams Up with Microsoft and TSMC for Photonic Simulation
Companies collaborate to speed up simulation and analysis of silicon photonic components, according to Ansys.

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