Supermicro New Generation X9 Embedded Building Block Solutions Available

By DE Editors

Super Micro Computer unveiled its latest embedded building block solutions at the recent Embedded Systems Conference (ESC) 2012 in San Jose, Calif.

New products feature higher I/O bandwidth with PCI-E 3.0 and USB 3.0 support, lower power consumption through our high-efficiency (95%)  digital switching power supplies, highest availability and reliability with N+N+N Redundant Battery Backup Power Supply (BBP) modules and higher-performance with integration of new generation Intel Xeon E5,  and future generation Core processors. New high-end Dual Processor (DP)  and Uni-Processor (UP) motherboards are available in industry standard Mini-ITX, Micro-ATX, ATX, Extended ATX and other form factors,  delivering cost and application optimized solutions for a variety of embedded applications.
 
For high-end, memory-intensive applications, embedded DP series motherboards offer up to 512GB in 16 DIMM slots and the UP series offers up to 256GB in 8 DIMM slots, each supporting DDR3 1600MHz Reg. ECC. Storage expansion is enabled with onboard RAID functionality and support for higher speed 6Gb/s SATA3 drives. For maximized I/O,  Supermicro offers a premiere DP motherboard that provides 11x PCI-E slots optimized for display wall control and high-performance PCI-E based SSD applications.

Addressing mid-range applications, Super Micro offers cost-effective Intel Xeon E3-1200 based UP motherboards. For low power, energy efficient solutions, Supermicro is expanding its line of mini-ITX embedded motherboards supporting Intel second Generation Core processors with Mobile Chipsets.

For more information, visit Super Micro.

Sources: Press materials received from the company and additional information gleaned from the company’s website.