Super Micro Brings MicroBlade to CeBIT 2014

Super Micro Computer (Supermicro) exhibited its latest products at CeBIT 2014 in Hannover, Germany last week. The company displayed its Atom-based MicroBlade platform at Intel’s CeBIT 2014 OEM Showcase as the model platform for emerging Microserver markets.

“Our new Intel Atom based platforms including the 6U 112-Node MicroBlade and 3U 24-Node MicroCloud are defining the future of green computing with solutions that support a wide range of workloads in enterprise, extreme scale-out data center, cloud and SMB applications,” said Charles Liang, president and CEO of Supermicro. “Additionally with next generation platforms supporting NVMe, 12Gb/s SAS3 and native 10GbE/40GbE, Supermicro offers the world’s most extensive range of advanced power conserving server, storage and networking solutions on the market.”

The 6U 112-node MicroBlade is an extreme-density, ultra energy-efficient micro server system featuring ultra-low-power Intel Atom C2000 series SoC processors (up to 8-cores). This modular Blade architecture maximizes rack utilization with 112 independent power-conserving nodes (as low as 10W each) enabling up to 784 servers per 42U rack. Even higher density can be achieved with the Intel Atom-based architecture, which can support up to a maximum 224 nodes. The MicroBlade enclosure incorporates dual Chassis Management Modules (CMM) and up to four Ethernet switch modules.

The switch modules, Intel ® Ethernet Microserver Switch Module FM5224, were co-developed by Intel and Supermicro and utilize the Intel Ethernet Switch FM5224, which offers advanced features such as 400nS cut-through latency, advanced load balancing and network overlay tunneling support, the company says. The FM5224 switch module features SDN functionality and includes an Intel Atom C2000 control plane processor and can support up to 2x 40Gb/s QSFP or 8x 10Gb/s SFP+ uplinks and 56x 2.5Gb/s downlinks per module.

Up to eight hot-swappable redundant (N+1 or N+N) 1600W Platinum-Level high-efficiency (95%) digital power supplies and heavy duty cooling fans are also integrated into the rear of the enclosure.

The new energy-efficient 3U MicroCloud features 24x nodes in 12x hot-swappable trays, each node supporting an Intel Atom C2750 (8-Core) processor, 32GB VLP DDR3 UDIMM, 2x 2.5-in. SATA3 (6Gb/s) HDD/SSDs and dual GbE LAN.

The new 4U 4-Way 96 DIMM SuperServer supports quad Intel Xeon processor E7-8800/4800 v2 (155 watt, 15-Core) processors, up to 6TB DDR3 1600MHz ECC R/LRDIMMs, up to 48x 2.5-in. hot-swap HDD/SSDs, 12Gb/s SAS3, 11x PCI-E 3.0 slots, dual 10GBase-T ports plus 1x dedicated LAN port for IPMI 2.0 remote monitoring.

For extreme HPC applications, the new 2-node 4U FatTwin supports two ultra-high-performance compute nodes, each node supporting dual Intel Xeon E5-2600 v2 processors (up to 130W TDP), 6x Intel Xeon Phi Coprocessors and up to 1TB ECC DDR3, up to 1866MHz in 16x DIMM slots.

For more information, visit Supermicro.

Sources: Press materials received from the company and additional information gleaned from the company’s website.