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June 8, 2012
By DE Editors
Molex and Radiall have expanded their SMP-MAX series with new symmetrical adapters and RF coaxial interconnect solutions for board-to-board, module-to-module and panel-to-panel telecom applications. As a second source, Molex is designing, manufacturing and marketing these connectors for global customers.
The new SMP-MAX symmetrical adapters eliminate the risk of assembly errors during manufacturing. Molex has more than 80 specific SMP-MAX connector designs that have been developed for global telecom customers. The connectors are currently being deployed in numerous wireless telecom projects in North America, Europe and Asia as a cost-effective solution adaptable to virtually any configuration.
The SMP-MAX can handle a maximum board-to-board distance tolerance of up to at least 2.00 mm (0.078 inch) gap without a spring” much greater than the standard SMP. It also features a three-degree tilt (radial travel), it has an operating frequency range of DC-6 GHz, a 1.2 max VSWR up to 3 GHz, and it can handle up to 300 Watts of power at 2.7 GHz.
For more information, visit Radiall and Molex.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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DE EditorsDE’s editors contribute news and new product announcements to Digital Engineering.
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