New Electrodeposition Module for COMSOL Multiphysics Released

Expansion module empowers shape and composition modeling and simulation of electrodeposits.

Expansion module empowers shape and composition modeling and simulation of electrodeposits.

By DE Editors

COMSOL, Inc. has announced the release of the Electrodeposition Module, a new add-on expansion module for the company’s flagship product, COMSOL Multiphysics. The Electrodeposition Module provides engineers the ability to model and simulate the shape and composition of electrodeposits for such processes as copper and gold electroplating in the electronics industry, wear and corrosion-protective coatings of mechanical parts, decorative coatings such as chrome and nickel plating of automotive parts, as well as electroforming of thin and complex manufactured parts.

“The Electrodeposition Module allows for very accurate descriptions of the electrochemistry, heat transfer, and fluid flow in electrochemical cells used for electrodeposition,” says Dr Henrik Ekstrom, technical program manager for electrochemical applications at COMSOL. “With this tool, developers can run realistic simulations of electrodeposition processes, from the micro-scale on up, using interfaces tailored for exactly these applications. This saves a lot of time and money in the development process.”

The Electrodeposition Module enables simulations for investigating the influence of cell and electrode geometry, chemistry, material properties, and operating conditions. The shape and composition of a deposited metal layer is modeled with either a thickness variable for very thin layers or as a moving boundary for thicker layers.

The Electrodeposition Module has interfaces for secondary and tertiary current distribution. Laminar flow and heat transfer interfaces, including predefined couplings for electrochemical cells, are also included in the module. Turbulent flow and two-phase flow capabilities are available in combination with COMSOL’s CFD Module.

The secondary current distribution interfaces handle the electrode kinetics at the electrode surfaces and the current conduction in the electrodes and electrolyte. The tertiary current distribution interfaces also include the material balances of the ions in the electrolyte, with transport by diffusion, migration, and convection, which can be modeled together with fluid flow in the cell.

For more information, visit COMSOL.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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DE Editors

DE’s editors contribute news and new product announcements to Digital Engineering.
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