Mechdyne, Raytheon and Rockwell Collins Demonstrate Collaborative CAD Review Sessions

By DE Editors

Mechdyne Corporation is partnering with Raytheon and Rockwell Collins to demonstrate a new technology to interact with and share computer-aided design (CAD) data across remote collaborative immersive environments at the Defense Manufacturing Conference (DMC) in Las Vegas.

Mechdyne’s Conduit visualization software provides the framework for this solution that the company says can shorten the design cycle by supporting remote design reviews and interactions.

Used in conjunction with a desktop CAD application and Mechdyne’s immersive display systems, Conduit provides users the ability to load CAD models on one system, and share them with users in other locations.  This new solution allows all parties to interact and discuss a design in real time.

“Mechdyne was a valuable technology partner in developing a commercial solution for the difficult task of communicating between multiple users in a multi-CAD collaborative environment,” says Jack Harris, director of Advanced Manufacturing Technology at Rockwell Collins.

NX from Siemens is being used to load a CAD assembly containing parts designed from several suppliers. The demonstration highlights how each member of the supply chain can be “virtually” present during a design review to see how the sub-assemblies fit together and determine if design flaws are present. In addition to Conduit, the Mechdyne-developed 3D Review Station is one of the display systems used for the collaborative demonstration.

Mechdyne’s Conduit software was extended to meet the specific remote collaboration needs defined by members of a collaborative,  industry/educational partnership, including: Mechdyne, Raytheon, Rockwell Collins, PDES Inc., SCRA, InTolerance, and the Virtual Reality Applications Center at Iowa State University.

For more information, visit Mechdyne Corporation.

Sources:  Press materials received from the company and additional information gleaned from the company’s website.