Latest News
Hexagon Launches HxGN Alix
Siemens Releases AI-Augmented Electronic Systems Design Software
Siemens and Microsoft Deliver AI-Boosted NX X to Azure
EOS Debuts New Alloys for Metal Additive
HP Partners with ArcelorMittal on Additive Manufacturing Plans
A GPU Revolution in Discrete Element Method Applications
All posts
June 6, 2018
On the second day at CAASE 18 (Conference on Advancing Analysis & Simulation in Engineering, June 5-7, 2018 in Cleveland), cohosted by NAFEMS and DE, Jerry Overton from DXC Technology took the stage to convince the show’s 500+ attendees of something many might find unbelievable: AI (artificial intelligence) is cool, useful practical, and — perhaps most important — do-able.
Subscribe to our FREE magazine,
FREE email newsletters or both!
Join over 90,000 engineering professionals who get fresh engineering news as soon as it is published.
Latest News
Hexagon Launches HxGN Alix
Siemens Releases AI-Augmented Electronic Systems Design Software
Siemens and Microsoft Deliver AI-Boosted NX X to Azure
EOS Debuts New Alloys for Metal Additive
HP Partners with ArcelorMittal on Additive Manufacturing Plans
A GPU Revolution in Discrete Element Method Applications
All posts
About the Author
Kenneth WongKenneth Wong is Digital Engineering’s resident blogger and senior editor. Email him at [email protected] or share your thoughts on this article at digitaleng.news/facebook.
Follow DE#18921
New & Noteworthy
New & Noteworthy: Future-Proof Foundation for Employee Training and Education
Eagle Point Software's Peak Experience for Pinnacle Series adds AI chat, improved...
Eliminate Physical Clamping – With Simulation
The Virtual Clamping tool in ANSA (VCA) from BETA CAE Systems eliminates...
New & Noteworthy: Fast, Flexible and Scalable Simulation – In the Cloud
Ansys Access on Microsoft Azure enables seamless deployment of industry-leading simulation tools...
New & Noteworthy: Safe, Cost-Effective Metal 3D Printing - Anywhere
Desktop Metal’s Studio System offers turnkey metal printing for prototypes and...