LiquidCool Solutions Launches Newest Technology at SC15

LiquidCool Solutions (LCS) will launch its newest technology, the Clamshell, at SuperComputing 2015 (SC15) November 15-20 in Austin, Texas. Traditional data centers account for 2% of electrical energy use worldwide, and more than half of that energy is wasted, according to LCS. the company’s technology is designed to reduce the amount of energy needed to cool servers as much as 98%.

LCS says its Clamshell server is low-cost and flexible enough to meet Open Compute Project design standards. Furthermore, it is possible to control dielectric fluid temperature so that it leaves the rack at 125 degrees F, hot enough to provide useful heat via a commercially available liquid-to-liquid heat exchanger. Preliminary bench test results suggest that 90% of all energy input to an LCS-cooled server can be recycled, the company says.

“A Clamshell server costs about the same as a comparably provisioned air-cooled server, so benefits including significantly reduced operating costs, smaller footprint, elimination of water use and silent operation come for free,” says Herb Zien, CEO, LiquidCool Solution. “With Clamshell servers and racks as an option it is difficult to justify the additional capital investment required to build and support an air-cooled datacenter.”

Compute Anywhere (Explorer) is a mobile, energy efficient, high performance compute solution. Image courtesy of LCS.

LCS will also display its Explorer 8 at SC15, which is eight servers in a ruggedized and shock-isolated case. The Explorer 8 was launched earlier this year at the Emerald Warrior, the Department of Defense’s exercise that focuses on irregular warfare. LCS says Explorer 8 is a modular, go-anywhere, high performance, high reliability compute solution that overcomes harsh environment operating challenges with improved reliability and productivity.

Designed specifically for remote environments, using both the Intel Xeon processor and Intel Xeon Phi Coprocessor, the Explorer 8 provides efficient energy usage and improved scalability through modular design that expands computational capacity quickly.

LiquidCool Solutions is exhibiting at booth number 3304, as well as in the Emerging Technologies exhibits on Level 4, Room 14.

For more information, visit LiquidCool Solutions.

Sources: Press materials received from the company and additional information gleaned from the company’s website.