Integrated Deposition Solutions Partners with Advanced Printed Electronic Solutions
Goal of collaboration to forge application development and manufacturing partnership leveraging NanoJet technologies to accelerate product concept-to-production of applications.
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July 12, 2024
Aerosol printing technology manufacturer Integrated Deposition Solutions (IDS) and specialists in 3D printed electronics engineering and manufacturing services company, Advanced Printed Electronic Solutions (APES), are partnering to accelerate customer development of next-generation 3D printed electronics applications. Through the partnership, the companies will improve alignment of customer product development design requirements with manufacturing and process technologies.
Both IDS and APES will begin working closely to create a template-driven set of print processes, end-to-end concept-to-production methodology, leveraging each companies’ 3D printed electronic capabilities. IDS will focus on providing aerosol-based printed electronic platforms and modules, process recipes, collectively providing a high-performance manufacturing foundation. APES will work with customers, early in their AME journey, including supporting customer product concept definition and engineering development, and prototyping-to-pilot fabrication based on the foundation established by IDS in conjunction with the company’s in-house Neotech AMT 5-axis motion systems each equipped with IDS NanoJet capability.
“A strategic partnership with Advanced Printed Electronics Solutions is a tremendous opportunity to aid NanoJet users as they move their project from concept to reality. Success in printed electronics relies on a viable application, well suited materials, and a reliable printer. IDS has created an aerosol printing platform with industrial reliability and now, leveraging APES application engineering strengths, have a development pipeline for advanced manufacturing integration,” says Dov Phillips, sales manager for IDS. “There is a lot of momentum and excitement around aerosol printing for advanced electronics packaging, biomedical, optical, and flexible hybrid electronics, applications and having a partner like APES who will work closely with clients to hone in on these use-cases is a really great resource we can now offer our customers.”
“By bridging the gap that exists today between product engineering teams and 3D printed electronics fabrication technologies, not to mention the significant expertise required across each, I believe we can accelerate customer product development and accelerate the process required from R&D to pilot manufacturing, followed by scaling as needed for production,” says Rich Neill, CEO and founder of APES. “A key part of this strategy is to benefit the customer by leveraging the combined expertise between IDS and APES in engineering while incorporating proven manufacturing technologies that are reliable and hardened 3D printed electronic solutions.”
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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