Future Facilities Announces New Electronic Cooling Software for Thermal Analysis

By DE Editors

Future Facilities has announced 6SigmaET electronic cooling software, which it says is the first major product for electronics thermal analysis developed in the last decade.

“6SigmaET was developed by some of the industry’s leading software designers with many years experience of the application of CFD to electronics cooling. They were given the opportunity to start from scratch without the restrictions involved in working with software that was developed originally a decade ago,” said Sherman Ikemoto, North American general manager of Future Facilities.

6SigmaET is designed to streamline model creation, gridding, solving, and post-processing. An automated process is used to convert incoming computer aided design data to intelligent objects such as the chips, capacitors, resistors, and other components on a printed circuit board, and complex shaped heatsinks, etc. A heatsink can be snapped onto a chip and a chip can be snapped onto a board. It enables automatic meshing, such as increasing the grid density in critical areas.

6SigmaET solves the conduction equations required to accurately simulate rotated or angled geometry such as angled DIMMs. 6SigmaET also provides an updated user interface designed to reduce learning time and also promises to reduce the time required to perform basic modeling and reporting tasks.
6SigmaET bases reporting on the intelligent objects in the model, such as the electronic components, rather than abstract, geometric constructs, reducing the time needed to obtain information necessary to evaluate or characterize the design.

For more information, visit Future Facilities.

Sources: Press materials received from the company and additional information gleaned from the company’s website.