FLOTHERM and FLO EMC V6 Improve Integration of Thermal and EMC Simulation

By DE Editors

Flomerics(Marlborough, MA) has released Version 6 of its integrated analysisenvironment for physical design of electronics, with improvedcommunication between thermal and electromagnetic compatibility (EMC)simulation. The latest FLOTHERM and FLO/EMC software packages furtherreduce the time required for integrated simulation by automaticallygenerating two different meshes, one optimized for thermal simulationand one for EMC simulation.

The need for two meshes arises from the fact that the physics aredifferent in thermal and EMC problems; grid refinement is required indifferent places. Examples of critical areas in thermal models includethe areas between the fins of a heat sink and regions surroundingcomponents that dissipate a lot of power. On the other hand, criticalareas for EMC simulation include seams and small openings in theenclosure where radiated emissions occur. FLOTHERM and FLO/EMC Version6 make it possible for users to optimize thermal and EMC meshesindependently. Geometric feature changes in the design automaticallypropagate between the models while leaving mesh refinements intact.

FLOTHERM can now access the Web-based SmartParts3D library directly,using compact models and reducing the time required for modeling andanalysis. Many manufacturers of fans, heat sinks, thermal interfacematerials, and other components have contributed data to theSmartParts3D library, located at smartparts3d.com.Version 6 now makes it possible to launch a Web browser from within thethermal analysis software and simply click on a compact model to add itto the thermal simulation. FLO/EMC V6 enables users to create compactmodels that accurately describe the electromagnetic signature ofradiating items such as printed-circuit boards.

The package provides a new tetrahedral object that provides a betterrepresentation of curved, thick 3D shapes and can now model ambienttemperatures that vary with time. The thermal simulation software canmodel angled fans and resistances and centrifugal blowers. FLO/EMCexpands external excitation mode capability by making it possible toarbitrarily define the incident angle and polarization. EMC specificlibraries such as sources, supports, and gaskets are also new toVersion 6. Solvers will be supported with a number of 64-bit processorsincluding AMD Athlon 64, AMD Opteron, Intel Xeon with EM64T and IntelPentium 4 with EM64T.

Flomerics offers a new step-by-step guide (floemc.com/stepbystep)that explains how engineers can integrate thermal and EMC design tohelp identify and resolve system-level mechanical design issues. Formore information, visit flomerics.com.