EOS to Exhibit Laser-sintering at AUVSI 2009

Laser-sintering capabilities offer weight and cost reductions to unmanned aerial vehicle manufacturers.

Laser-sintering capabilities offer weight and cost reductions to unmanned aerial vehicle manufacturers.

By DE Editors

EOS GmbH Electro Optical Systems will be offering a number of technical exhibits and resources at the 2009 Association for Unmanned Vehicle Systems International (AUVSI)  Unmanned Systems North America conference at the Walter E. Washington Convention Center in Washington, D.C. on Aug. 10-13.

The company will be displaying parts made in their EOSINT P line of plastics laser-sintering systems as well as parts in different metals from the EOSINT M 270. Udo Behrendt, key account manager, Aerospace, will be at the booth to answer questions and offer technical information. He has been responsible for business development in the civil aircraft, defense, and unmanned aerial vehicle (UAV) industries.

“Weight optimization, different applications, and flexibility in payload are critical to the design of UAVs,” Behrendt says. “The aircraft industry also primarily uses low-volume components. Laser-sintering technology enables companies to build highly integrated and very complex hardware directly from electronic data, eliminating tooling, and other secondary operations, in production lots ranging from one part to several thousands.”

For more information, visit EOS.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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DE Editors

DE’s editors contribute news and new product announcements to Digital Engineering.
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