Enabling Tech to Transform PCB Assemblies

The Occam Group (TOG) is bringing its solderless assembly technology to industry to impact the way components are assembled.

“Occam is not simply a new process but rather an enabling technology allowing the industry to move toward a future where higher reliability, lower costs and less environmental impact are the norm,” says Occam Inventor Joe Fjelstad. 

The company seeks partners to help bring the Occam process to the market, and believes that EMS providers serving markets where high reliability electronics are essential are best positioned to take full advantage of this technology. EMS play a central role as providers of the types of services Occam will affect most: the pcb and assemblies. 

The Weakest Link

Some common manufacturing defects and failures in electronic products are related to solder pads and solder joints, especially in high reliability applications. Many failures occur as a result of solder fatigue due to shock and vibration and/or repeated thermal excursions in operations or rework. Since Occam is solderless, solder related failures are non-existent.

Occam bypasses the weakest link, inherently driving up product reliability while opening up a host of new capabilities for product designers.

Sources: Press materials received from the company and additional information gleaned from the company’s website.