UGS Launches Teamcenter 2005UGS seeks to close the gap between idea capture, comprehensive product lifecycle management, and regulatory complianceUGS Corp. (Plano, TX) has announced Teamcenter 2005, a major release ofthe entire portfolio of its digital lifecycle management solution.Teamcenter 2005 integrates idea management and requirements planningwith comprehensive digital product development, digital manufacturing,and digital lifecycle management processes. The focus for Teamcenter2005, says UGS, is on addressing three of three critical productdevelopment and lifecycle management initiatives: new productdevelopment and introduction (NPDI), global product development, andregulatory complianceTeamcenter serves as the enterprise collaboration backbone thatprovides a comprehensive integrated digital manufacturing process. WithTeamcenter 2005, UGS delivers a new platform technology that speedsimplementations across all aspects of a product’s lifecycle. Itdelivers fully integrated applications for up-front product planningand strategy, along with enhanced integration to Microsoft Officeapplications.For capturing an organization’s best ideas and building them intoinnovative products, Teamcenter 2005’s NPDI capabilities build offcommon MS Office tools, provide functionality to promote and captureinnovation, and fosters an open and collaborative environment forsharing ideas within and without an organization. It also providesframeworks for collaborative decision support, management andcoordination of new product development and introduction, and aframework of planning and execution tools that optimize product andservices launch processes.Teamcenter 2005 offers a variety of functionality to support globalproduct development, including simplified installation and deploymentof automated digital validation capabilities. It has enhancedintegration with the Microsoft Office System, Windows Server, andWindows Share Point Services v2; expanded multi-CAD management withadded support for UGS NX CAE/Routing, Autodesk Inventor, MentorGraphics harness, Cadence PCB, Zuken PCB, and ECAD visualization;product definition management tools for and CAD integration and productstructure, configuration, and change management; project managementcapabilities; and the ability to synchronize design data, share designmodels in workflow-driven processes, and collaborate across a fullydigital product development environment.Teamcenter 2005 introduces several new enhancements that enablecompanies to strike a balance between regulatory compliance andlifecycle performance. These include a functional foundation thatenables users to directly enforce and validate regulatory compliance.Key capabilities include the management of information access,retrieval and retention, along with process visibility and integrity.Teamcenter 2005’s enhanced document and records retention managementcapabilities support DoD 5015.2 standards. This foundation alsoprovides the base for process-specific and industry-driven complianceincluding, Sarbanes Oxley compliance management; environmental mandatessuch as ELV, RoHS, and WEEE; medical device mandates such as CFR Part11 and 820; and export controls such as ITAR and EAR.Click here to access some online webinars and videos on Teamcenter. For complete details, click here.

Editor’s Pick of the Week—June 22, 2005 Integrated Fluid Dynamics Tool Facilitates Analysis/OptimizationNIKA unveils a new integrated fluid flow and heat transfer simulation product for Pro/Engineer. NIKA GmbH(Frankfurt am Main, Germany) has unveiled a new analysis package calledEFD.Pro, described as a fully integrated fluid flow and heat transfersimulation product for Pro/Engineer. The package enables users tocreate designs with Pro/Engineer and then immediately analyze andoptimize them, without translating any data. Features include automaticmeshing, automatic detection of the fluid region, and automaticlaminar-turbulent modeling, plus analysis of simultaneous flows ofgases and liquids, heat transfer, and forces on immersed or surroundingsolids.While the same mathematical and physical foundation as traditional CFD(computational fluid dynamics) programs is incorporated, the user canavoid having to produce complex numerical and mathematical schemes.“We welcome NIKA as a valuable addition to PTC’s Partner AdvantageProgram,” said Dr. Carsten Hochmuth, director of software andtechnology partner programs at PTC. “Fluid flow and heat transferanalysis programs have increasingly become an essential part of theproduct development processes employed by our customers.“EFD.Pro uses the original Pro/Engineer parts and assemblies withoutrequiring the user to model the flow domain separately. The graphicalpreprocessor guides the user step-by-step through the physical datadefinition process using the Pro/Engineer model.“EFD.Pro is our latest product to provide seamless integrationbetween a leading design program and our ground-breaking analysistechnology,” said NIKA Managing Director Roland Feldhinkel.EFD.Pro offers analysis capabilities such as compressible andincompressible liquids and gases, laminar and turbulent flows, heattransfer, and species transport for steady-state and transient flowregimes, as well as numerous other physical models. A graphicalpostprocessor is also fully integrated into the package, and it offerscomprehensive results visualization and valuation capabilities withtight connectivity to MS Excel and MS Word using the originalPro/Engineer model.To find out more about EFD.Pro, please visit nika.biz.

 

Editor’s Pick of the Week—June 15, 2005  ANSYS 10 Upgrades Performance and Physics in Fluid-Structure Interaction Version 10.0 features integrated flexibility and improved solving capabilities.ANSYS, Inc. (Canonsburg, PA) has announced Version 10.0 of its flagshipANSYS engineering simulation system. The new release offers majoradvances in performance, ease-of-use, interoperability, and coupledphysics technology, such as fluid structure interaction (FSI). Withversion 10.0, the company also introduces CAE design tools for rotatingmachinery and blade design.Continuing to expand its multiphysics technology, ANSYS 10.0 offerscapabilities for complex FSI problems. The FSI functionality uses eachof the best-in-class technologies in stress and fluid flow analysis. Asingle geometry is used for both, with meshing appropriate to thespecific physics required. A high-speed protocol provides thecommunication necessary to perform dynamic FSI analysis. And itparallelizes on multi-machine clusters for very large problem sizes.Further strengthening the industry-specific capabilities in itsWorkbench environment, ANSYS 10.0 introduces design tools for rotatingmachinery and blade design: ANSYS BladeModeler, a 3-D rotatingmachinery design tool for bladed components and ANSYS TurboGrid, ahexahedral meshing tool for blade design.In the mechanical application area, ANSYS 10.0 includes thermaltransients implemented within ANSYS Workbench. To address the need forefficient and timely execution of analysis problems of ever-increasingsize and complexity, the ANSYS 10.0 parallel solver now supports newchoices in both communications technology as well as processors. Inaddition to Ethernet and Gigabit Ethernet, ANSYS Workbench now supportsWindows XP 64-bit for AMD and EM64T chipsets. This support eliminatesthe 2GB memory limit that many users face when running large models onWindows. In addition, it provides the opportunity to add extra physicalmemory, which ANSYS uses to complete the entire solution withoutwriting to the hard disk—which is usually the source of extendedcomputation times.Other features in ANSYS 10.0 include a new modal port definition forhigh-frequency electromagnetics applications, gyroscopic effects thatenhance the performance of ANSYS for rotor dynamics application ofturbomachinery, and structural-thermal-electric coupling enhancementsfor direct-coupled field physics.ANSYS 10.0 shipments begin in July, and the new version is completelycompatible with ANSYS 9.0. For more information, visit the ANSYS website. Click here to view online demos of CFD and FEA analysis. For a sneak preview of our July 2005 feature article on FSI, click here.