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February 3, 2017
DuPont Packaging has finalized its panel of packaging experts for its annual DuPont Awards for Packaging Innovation. Now in its 29th year, the DuPont Packaging Awards inspire excellence and catalyze innovation across the packaging chain and around the globe, the company states. Entries will be accepted until February 10, 2017.
According to a company press release,
- Oktay Aral – Global Flexible Packaging R&D Lead, pladis, Turkey
- Jason Barber – Principal R&D Engineer, PepsiCo., USA
- David Luttenberger, CPP – Global Packaging Director, Mintel Group Ltd., USA, (Lead Judge)
- Tom Manske – Director, Global Snacks R&D – Packaging Research, Quality, Nutrition and Technology, The Kellogg Company, USA
- Anirban Mukherjee – Director Global Packaging – Asia Pacific, Johnson & Johnson, Singapore
- Eric Pavone – Business Development Director - Web-fed, BOBST, Switzerland
- Hari Reddy, Vice President R&D, Bemis North America, Bemis Company Inc., USA
- Claire Sarantopoulos – Senior Scientist, Center of Packaging Technology of the Food Technology Institute, Brazil
- Richard Smith – Manufacturing Systems Manager, Amcor Flexibles Asia Pacific, Australia
For more information, visit DuPont Packaging.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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RAPID + TCT 2025 to Return to Detroit
COMSOL Version 6.3 Officially Available
Meltio Engine Blue Integration Kit Now Available
TRUMPF Unveils LPBF Machine at Formnext
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About the Author
DE EditorsDE’s editors contribute news and new product announcements to Digital Engineering.
Press releases may be sent to them via [email protected].
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