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March 14, 2012
By DE Editors
Docea Power has released the AceThermalModeler (ATM) software, a solution for generating compact thermal models for System on Chips (SoCs), 3D ICs, Systems in Package (SiPs) or complete boards.
Compact thermal models enable early system floorplan exploration or partitioning, new system packaging and integration architectures, and early exploration of power management policies to reduce temperatures peaks, and manage temperature gradients across the system.
With ATM, thermal experts can give system architects a solution that generates RC compact thermal models that are fast to create and simulate, the company says. The system architecture team can then work autonomously to estimate various corner use cases, floorplans, architecture options for multi-core designs, operating points or power management policies impact on temperature across the system.
For more information, visit Docea Power.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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