Digi International Announces ConnectCore Development Kit
The kit includes a compact Pico-ITX form factor.
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December 19, 2016
Digi International, a provider of machine-to-machine and Internet of Things (IoT), has made the ConnectCore for i.MX6UL Development Kit available.
According to Digi International, the Off-the-shelf Single Board Computer is built on the ConnectCore for i.MX6UL module, the SBC delivers a complete off-the-shelf SBC with all the features and capabilities to build industrial-strength wired and wireless connected devices. Features include:
- A compact Pico-ITX form factor (100mm x 72mm) with mounting options, industrial operating temperature range, 256 MB of highly reliable NAND flash and 256 MB DDR3 memory—both expandable to 2GB.
- Wired and wireless connectivity through dual 10/100 Mbit Ethernet networking, pre-certified 802.11a/b/g/n/ac networking, and Bluetooth 4.2 with Bluetooth low energy (LE) connectivity with external antenna options, and Near-field communication (NFC).
- Optional cellular connectivity via PCI Express Mini Card and integrated Micro SIM slot.
- Digi XBee socket supporting the broad line of Digi XBee RF modules for 802.15.4, ZigBee, Thread, Digi Mesh, and Sub-GHz wireless connectivity.
- 24-bit LVDS and RGB parallel LCD support (up to WXGA), camera, SD card storage, on-board eMMC flash option, energy-harvesting NFC tag capabilities (NXP NTAG), USB host/device, I/O connectors (CAN, UART, SPI, I2C, GPIO), user LEDs and buttons, power in/out, and battery connector.
- Industrial operating temperature from -40 to 85°C, and IEC 60068-2 temperature, shock, and vibration rated compliance.
For more information, visit Digi International.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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