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December 19, 2016
Digi International, a provider of machine-to-machine and Internet of Things (IoT), has made the ConnectCore for i.MX6UL Development Kit available.
According to Digi International, the Off-the-shelf Single Board Computer is built on the ConnectCore for i.MX6UL module, the SBC delivers a complete off-the-shelf SBC with all the features and capabilities to build industrial-strength wired and wireless connected devices. Features include:
- A compact Pico-ITX form factor (100mm x 72mm) with mounting options, industrial operating temperature range, 256 MB of highly reliable NAND flash and 256 MB DDR3 memory—both expandable to 2GB.
- Wired and wireless connectivity through dual 10/100 Mbit Ethernet networking, pre-certified 802.11a/b/g/n/ac networking, and Bluetooth 4.2 with Bluetooth low energy (LE) connectivity with external antenna options, and Near-field communication (NFC).
- Optional cellular connectivity via PCI Express Mini Card and integrated Micro SIM slot.
- Digi XBee socket supporting the broad line of Digi XBee RF modules for 802.15.4, ZigBee, Thread, Digi Mesh, and Sub-GHz wireless connectivity.
- 24-bit LVDS and RGB parallel LCD support (up to WXGA), camera, SD card storage, on-board eMMC flash option, energy-harvesting NFC tag capabilities (NXP NTAG), USB host/device, I/O connectors (CAN, UART, SPI, I2C, GPIO), user LEDs and buttons, power in/out, and battery connector.
- Industrial operating temperature from -40 to 85°C, and IEC 60068-2 temperature, shock, and vibration rated compliance.
For more information, visit Digi International.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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Latest News
Ansys Government Initiatives Picked to Join Microelectronics Commons
Simplify Simulation Data Analysis with Noesis Solutions Tool
Lantek Launches v44 of its Sheet Metal Manufacturing Software
Nano Dimension Unveils 3D Printer for Micro Applications
Prusa CORE One 3D Printer Serves as Foundation of New Line
Dassault Systèmes Announces Winners of India-Based Product Design Competition
All posts
About the Author
DE EditorsDE’s editors contribute news and new product announcements to Digital Engineering.
Press releases may be sent to them via [email protected].
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