CoolitPCB Facilitates Board-level Thermal Analyses

Helps predict thermal behavior of designs and pinpoint optimum component placement.

Helps predict thermal behavior of designs and pinpoint optimum component placement.

By DE Editors

CoolitPCB, a new software package from Daat Research(Hanover, NH), was created to enable PCB designers to perform their ownboard-level thermal analyses. Engineers now can accurately predict thethermal behavior of their designs and pinpoint optimum componentplacement on their boards, says Daat, adding that there is no need forexpert knowledge of heat transfer or CFD—CoolitPCB’s intelligent userinterface steers the user through the solution process. The solution isbuilt around a computational engine that has been successfully used forhundreds of design projects, says the manufacturer.

The software features the ability to import board designs from CAD andEDA software and offers performance-testing for standard JEDEC forced,free convection slots as well as custom setups. In addition, thesoftware can report component-junction temperature and casetemperature, as well as detailed 3D airflow and temperaturedistribution.

CoolitPCB is fully integrated with Daat’s flagship thermal designsoftware, Coolit. Price: $3,900 (for a perpetual license). For furtherinformation, visit coolitpcb.com.




 

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DE Editors

DE’s editors contribute news and new product announcements to Digital Engineering.
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