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May 20, 2014
In 2013, 3D Systems and Google/Motorola teamed up for Project Ara to build modular smart phones with infinitely customizable configurations, allowing users to upgrade their phones piece by piece.
We last wrote about Project Ara in April, when Google announced its developer’s kit at the Project Ara Developers Conference. Now 3DS has unveiled more details about the additive manufacturing system in a recent blog post.
According to the company, the production platform ditches the “reciprocating” model of the print platform and print head moving in coordinated fashion for a continuous motion system and racetrack architecture that will enable print rates in the millions. The company is developing conductive inks (along with Carnegie Mellon University and X5 Systems) for parts lik the antennas. Modules will be printable in a full spectrum of colors, as well as in hard and soft composite materials.
“The combination of exponential creation technology with exponential information technology translates to unprecedented capability and adaptability for the consumer,” said Chuck Hull, founder and CTO of 3DS in the blog post. “The scale of this project and its practical functionality are an exciting step into the future.”
When the phones launch in 2015, there will be three sizes available, including a “mini” that could measure just 2-x-5 in.
According to this article over on Pocket-lint, a recently announced partnership between Sennheiser and Phonebloks (the development group that helped create the project) means that Sennheiser audio “bloks” may be available for the phones.
Source: 3D Systems
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Brian AlbrightBrian Albright is the editorial director of Digital Engineering. Contact him at [email protected].
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