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Editors Pick of the Week

Creaform Extends 3D Scanning Line to More Users
September 16, 2009
Company sees new UNIscan offering new users high-level performance at an entry-level cost.
Editor’s Pick: Upfront Design Studies Made Easier
September 9, 2009
New version of CFdesign 2010 provides CAD-driven multi-scenario environment.
Upfront Design Studies Made Easier
September 9, 2009
New version of CFdesign 2010 provides CAD-driven multi-scenario environment.
Editor’s Pick: Mobile Notebook Supports Intel’s i7 Extreme, Xeon Processors
September 2, 2009
Eurocom D900F Panther notebook functions as an engineering workstation and server.
Mobile Notebook Supports Intel’s i7 Extreme, Xeon Processors
September 2, 2009
Eurocom D900F Panther notebook functions as an engineering workstation and server.
Editor’s Pick: Simulate Complex Electronics
August 26, 2009
Coolit v.9 CFD software offers three ways to build complex IC models and two new compact resistor options.
Simulate Complex Electronics
August 26, 2009
Coolit v.9 CFD software offers three ways to build complex IC models and two new compact resistor options.
Editor’s Pick: Big Speed Boost for Electromagnetic Simulations
August 19, 2009
Remcom updates XStream GPU acceleration. Bundles it free with XFdtd 7.0.
Big Speed Boost for Electromagnetic Simulations
August 19, 2009
Remcom updates XStream GPU acceleration. Bundles it free with XFdtd 7.0.
Base Pricing for Entry-Level Supercomputer Starts at Less Than $12k
August 10, 2009
Cray expands its HPC offerings for more engineers and scientists with lower cost supercomputer.
Editor’s Pick: Base Pricing for Entry-Level Supercomputer Starts at Less Than $12k
August 10, 2009
Cray expands its HPC offerings for more engineers and scientists with lower cost supercomputer.
Editor’s Pick: Accelerate 3D Application Development
August 5, 2009
New Rapid Application Development Framework provides functions to save programming efforts
Accelerate 3D Application Development
August 5, 2009
New Rapid Application Development Framework provides functions to save programming efforts.
Editor’s Pick: ANSYS Releases Icepak 12.0 Fluid Dynamics Simulation Software
July 29, 2009
New simulation advancements in electronics thermal management reduce engineering time.
Editor’s Pick: ANSYS Releases SIwave 4.0
July 21, 2009
Includes advancements in signal- and power-integrity, electromagnetic compatibility testing.



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