Digital Engineering November 2017

Inside this Issue:

Cover Story: The Heart of the Engineering Workflow

New devices, new workstation classes and HPC-incorporated workloads expand the playing field for CPUs and GPUs.

PROTOTYPE: Industrial Issues in 3D Printing

3D printing industry confronts challenges of consistency, education and more.

SIMULATION: Modeling for Change

Take a closer look at agile approaches that move away from being locked into traditional final signoff.

IOT: Building Blocks of IoT Design

The rise of the internet of things could shift the designer’s focus from system-on-a-chip to system-in-package.

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Latest News

WIN Enterprises Announces the MB-65040 Mini-ITX with Intel Scalable Skylake Processor
MB-65040 supports the Intel Skylake-S CPU and Intel H110 chipset.

Auburn University Deploys $1.5 Million Digital X-Ray CT System for Additive Manufacturing Purposes
Customized system enables layer-by-layer quality assessment in real time.

CONTACT Software Issues CONTACT Elements Release with Software Modules
Users can benefit from comprehensive functional enhancements and the integration of agile processes.

Mobile Analysis 3D and 2D CAD Viewer “to Go” Now on Market
The CoreTechnologie 3D_Analyzer Viewer is now available through a mobile license-lending feature.

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