Digital Engineering April 2023

In the April issue of Digital Engineering, we focus on additive manufacturing, including support-free printing, multi-material applications, and designing for additive.

Inside This Issue:

Changing the Shape of Things to Come

Progress in 3D printing and additive manufacturing opens the door to greater applications of design-oriented tools.

Multimaterial Printing Gaining Ground

Material data is the key ingredient in multimaterial part performance simulation.

The Support-Free 3D Printing Balancing Act

Despite the upside to support-free 3D printing, supports should be considered as just another tool in the toolbox to optimize certain parts and applications.

Fine-Tuning the Hybrid Workforce

How to find the computational balance in a work-from-anywhere strategy.

How to Optimize Manufacturing Capacity

Use of virtual manufacturing networks has potential to lead to greater agility and resilience in the long run.

Replicating Nuclear Energy Operations in Digital Twins

Nuclear power plants adopt digital twins for components and systems.

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Latest News

Nano Dimension Plans Reveal of New Tech at Formnext
New resin for DLP 3D printers to also form part of technology showcase in Frankfurt, Germany, according to Nano Dimension.

NIST Awards Money to ASTM for Standardization Center
The new center is intended to aid U.S. engagement in international standardization for critical and emerging technologies.

NVIDIA Shares Blackwell Platform Design for Open Hardware Ecosystem
NVIDIA is sharing key portions of the NVIDIA GB200 NVL72 system electro-mechanical design with the OCP community.

SME Appoints New CEO
Kunz brings 24 years of manufacturing experience, recently as SME’s chief workforce development officer.

Digital Twins in Action in Manufacturing
At the virtual Design & Simulation Summit on Oct. 31, learn how digital twins will affect product development through real-world case studies.

HPE Launches AMD-Powered Solutions
New purpose-built offerings to enhance training for complex AI models, HPE says.

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