Samsung Electronics Selects Optomec’s Aerosol Jet for Next-Generation Electronics Production

Electronics producers are now using the aerosol jet process to print RF interconnects, replace wire bonds in IC packaging, print antennas directly onto electronics enclosures and create multi-layer, miniature circuits.

Electronics producers are now using the aerosol jet process to print RF interconnects, replace wire bonds in IC packaging, print antennas directly onto electronics enclosures and create multi-layer, miniature circuits.

Optomec announces that Samsung Electronics has commissioned an Aerosol Jet 5X System in its Printed Electronics Lab to enable next-generation electronics production.

Manufacturers use the aerosol jet's ability to print conductors and dielectric materials on 3D surfaces on many types of substrates. Electronics producers are now using the aerosol jet process to print RF interconnects, replace wire bonds in IC packaging, print antennas directly onto electronics enclosures and create multi-layer, miniature circuits—essentially eliminating the restrictive shapes of PCBs. These capabilities enable electronics designers to miniaturize products as well as change the form of the overall electronics package, allowing more organic and ergonomic designs.

Optomec Aerosol Jet 5X System. Image courtesy of Optomec.

The Optomec Aerosol Jet 5X system supports five-axis of coordination motion with a 200x300x200 mm (x, y, z) print envelope and the ability to print features ranging from 10 microns to millimeters. 

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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