REDCOM Electronics Manufacturing Completes Integration of New High Speed SMT Assembly Line

REDCOM Laboratories Inc. announced the availability of a new high-speed Surface Mount Technology (SMT) assembly line at its headquarters in Victor, NY.

According to a company press release, the line will include state-of-the-art assembly and inspection equipment plus the latest on-line New Product Introduction and performance monitoring tools. The line will be used to assemble and inspect Printed Circuit Board Assemblies (PCBAs).

Some elements of the new system include:

• Universal Fuzion SMT Component Placement System (48K placements/hour)
• Vitronics Soltec XPM3i 820 Reflow Soldering System
• Vi Technology 5K SPECTRO Automated Optical Inspection
• Air-Vac Engineering ONYX 29 Advanced SMT Production Rework & Assembly

“We’re excited by this investment in new automated technology and additional capability,” said Steve Husband, VP of manufacturing. “It’s not just about raising first-pass yields and increased capacity—we’re expecting a huge overall gain in productivity and quality, making us a preferred solution for initial prototype and production-level volumes in the contract manufacturing marketplace. We are eager to quote new and repeat business and confirm both our, and our customer’s, expectations.”

For more information, visit REDCOM Laboratories.