dSPACE Joins PACE Initiative

By DE Editors

dSPACE  has joined PACE (Partners for the Advancement of Collaborative Engineering Education) as a contributor in support of educating future automotive engineering leaders worldwide. Over the next three years, dSPACE will support PACE by providing dSPACE Rapid Control Prototyping (RCP) and Hardware-in-the-Loop (HIL) technologies to PACE institutions around the globe.

Established in 1999, PACE is a partnership of companies—GM,  Autodesk, HP, Oracle, Siemens PLM Software—dedicated to helping engineering and technology students as they prepare for careers in automotive design and engineering. PACE provides hardware, software,  training, automotive parts, industry projects, and more to strategically-selected academic institutions worldwide.   Additionally, PACE develops collaborations between industry and academia to give students access and hands-on experiences that are heavily used and relied upon by the automotive industry.

dSPACE is also a platinum sponsor of EcoCAR 2: Plugging in to the Future, a three-year collegiate engineering competition challenging 15 universities across North America to develop advanced electronic vehicle designs.

For more information, visit dSPACE.

Sources: Press materials received from the company and additional information gleaned from the company’s website.