Ansys Launches HFSS Mesh Fusion
Ansys’ new technology helps engineers improve product design for advanced applications ranging from autonomous vehicles to 5G communications.
Simulating electromagnetic interference chamber emissions of a touchscreen TV panel including capacitive sensor array. Image courtesy of Ansys.
January 21, 2021
Ansys has launched Ansys HFSS Mesh Fusion. HFSS Mesh Fusion drives rapid, fully coupled simulation of complex EM systems—without compromising design or fidelity.
HFSS Mesh Fusion, available in Ansys HFSS 2021 R1, helps engineers combine integrated circuits (IC), packaging, connectors, printed circuit boards, antennas and platform in a single Ansys HFSS analysis to predict EM interactions. HFSS Mesh Fusion bypasses previous barriers by applying optimal meshing technology at the component level, parallelized across cores, clusters or within Ansys Cloud. A solver technology then extracts a fully coupled, full-wave EM matrix. By enabling much more complex designs to be solved, companies can confidently push the limits of performance to create products.
By solving the most complex EM models, HFSS Mesh Fusion delivers critical design data that improves end products.
“HFSS Mesh Fusion helps IC designers effectively manage the capacity, complexity, dimensional range and density of geometric detail in a fully coupled EM simulation,” says John Lee, vice president and general manager at Ansys. “This empowers engineers to break the old rules, innovate leading-edge designs at higher frequencies and within tighter form factors, tape out with confidence and deliver trailblazing products with more functionality than ever thought possible. This supports numerous highly sophisticated applications, including 5G communications, autonomous driving and many more.”
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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